公开(公告)号：US20200337179A1

公开(公告)日：2020-10-22

申请号：US16914096

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Ming-Che Lee ,  Wei-Ming Chu ,  Cora Nien

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.

公开(公告)号：US20240314921A1

公开(公告)日：2024-09-19

申请号：US18121297

申请日：2023-03-14

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Baomin Liu ,  Cora Nien ,  Min Suet Lim ,  Tongyan Zhai

IPC: H05K1/02 ,  F16K31/50 ,  H05K7/20

CPC classification number: H05K1/0209 ,  F16K31/504 ,  H05K7/20254 ,  H05K2201/0209

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

公开(公告)号：US20220113092A1

公开(公告)日：2022-04-14

申请号：US17560070

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Baomin Liu ,  Cora Nien

IPC: F28D15/02 ,  H05K7/20 ,  F28D15/04

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first support structure that includes a first heat source, a second support structure that includes a second heat source, and a heat pipe that has a first side and an opposite second side, where the first heat source is coupled to the first side of the heat pipe and the second heat source is coupled to the second side of the heat pipe. In some examples, the heat pipe can be a vapor chamber.

公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.