公开(公告)号：US20180331035A1

公开(公告)日：2018-11-15

申请号：US15773896

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Yu Amos ZHANG ,  Mathew J. MANUSHAROW ,  Kemal AYGUN ,  Mohiuddin MAZUMDER

IPC: H01L23/528 ,  H01L23/50 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H05K1/02 ,  H01R13/6471

Abstract: A ground isolation webbing structure package includes a top level with an upper interconnect layer having upper ground contacts, upper data signal contacts, and a conductive material upper ground webbing structure that is connected to the upper ground contacts and surrounds the upper data signal contacts. The upper contacts may be formed over and connected to via contacts or traces of a lower layer of the same interconnect level. The via contacts of the lower layer may be connected to upper contacts of a second interconnect level which may also have such webbing. There may also be at least a third interconnect level having such webbing. The webbing structure electrically isolates and reduces cross talk between the signal contacts, thus providing higher frequency and more accurate data signal transfer between devices such as integrated circuit (IC) chips attached to a package.