公开(公告)号：US11646274B2

公开(公告)日：2023-05-09

申请号：US16444615

申请日：2019-06-18

Applicant: Intel Corporation

Inventor： Mufei Yu ,  Gang Duan ,  Edvin Cetegen ,  Baris Bicen ,  Rahul Manepalli

IPC: H01L23/00 ,  H01L23/522

CPC classification number: H01L23/562 ,  H01L23/5226 ,  H01L24/09 ,  H01L2924/3511

Abstract: An integrated circuit package may be formed comprising a substrate that includes a mold material layer and a signal routing layer, wherein the mold material layer comprises at least one bridge and at least one foam structure embedded in a mold material. In one embodiment, the substrate may include the mold material of the mold material layer filling at least a portion of cells within the foam structure. In a further embodiment, at least two integrated circuit devices may be attached to the substrate, such that the bridge provides device-to-device interconnection between the at least two integrated circuit devices. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board.