公开(公告)号：US20250112191A1

公开(公告)日：2025-04-03

申请号：US18374920

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Thomas WAGNER ,  Pouya TALEBBEYDOKHTI ,  Stephan STOECKL ,  Lizabeth KESER

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/13 ,  H01L23/48 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package comprises an interposer with at least one open area through the interposer. A first die is connected to a first side of the interposer. A second die is connected to a second side of the interposer. At least one metal pillar is connected to the first die that extends through the open area of the interposer and connects to the second die to provide a direct die-to-die connection through the interposer.