公开(公告)号：US20230307379A1

公开(公告)日：2023-09-28

申请号：US17703768

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Phil GENG ,  Patrick NARDI ,  Ravindranath V. MAHAJAN ,  Dingying David XU ,  Prasanna RAGHAVAN ,  John HARPER ,  Sanjoy SAHA ,  Yang JIAO

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/49816

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.