公开(公告)号：US20240314923A1

公开(公告)日：2024-09-19

申请号：US18123049

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Arumanayagam RAJASEKAR ,  Hariharan KALIYAVARATHAN ,  Srinivas REDDY B.M. ,  Yagnesh Vinodrai WAGHELA ,  Piyush BHATT

IPC: H05K1/02

CPC classification number: H05K1/0224 ,  H05K2201/2081

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment, the multi-layer shield comprises a metallic layer with a first surface and a second surface opposite from the first surface, and a conductive adhesive over the first surface of the metallic layer. In an embodiment, a base layer is over the second surface of the metallic layer, where the base layer is electrically insulating.