公开(公告)号：US20240214022A1

公开(公告)日：2024-06-27

申请号：US18145860

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Vamshi Krishna AAGIRU ,  Santhosh AP ,  Praveen Kashyap Ananta BHAT ,  Arjun C ,  Shailendra Singh CHAUHAN ,  Sajal Kumar DAS ,  Walid EL HAJJ ,  Isha GARG ,  Sagar GUPTA ,  Mallari HANCHATE ,  Mythili HEGDE ,  Siva Prasad JANGILI GANGA ,  Satyajit Siddharay KAMAT ,  Noam KOGOS ,  Ronen KRONFELD ,  Adiel LANGER ,  Gil MEYUHAS ,  Padmesh MURUGAN LATHA ,  Vishram Shriram PANDIT ,  Abhijith PRABHA ,  Manisha RAIGURU ,  Ehud RESHEF ,  Amir RUBIN ,  Shubham Kumar SAHU ,  Gurpreet SANDHU ,  Michael SHACHAR ,  Harry SKINNER ,  Madhukiran SRINIVASAREDDY ,  Gokul SUBRAMANIAM ,  Maruti TAMRAKAR ,  Jayprakash THAKUR ,  Vijaya Prasad UMMELLA ,  Yagnesh Vinodrai WAGHELA

IPC: H04B1/3827 ,  H04W52/36

CPC classification number: H04B1/3838 ,  H04W52/365 ,  H04B2001/3844

Abstract: Various principles and methods are described herein to improve wireless communication in a user computing device. Certain aspects of the disclosure describe management of wireless transmissions relative to various regulations related to a specific absorption rate. Other aspects of the disclosure relate to detection of user proximity to a transmitting antenna. Other aspects relate to alternative strategies to improve wireless communication, such as selection of alternate antennas or baseband modems, or changes in device orientation.

公开(公告)号：US20240172356A1

公开(公告)日：2024-05-23

申请号：US18056267

申请日：2022-11-17

Applicant: Intel Corporation

Inventor： Tejasweeni D LINGAYAT ,  Maruti TAMRAKAR ,  Sudarshan SOLANKI ,  Bala SUBRAMANYA ,  Yagnesh Vinodrai WAGHELA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/023 ,  H05K1/0218 ,  H05K1/115

Abstract: A printed circuit board includes a ground plane, a power plane having a first main surface and a second main surface opposite to the first main surface, wherein the second main surface faces the ground plane and a shielding structure partially covering the power plane. The shielding structure includes a metal structure covering a peripheral area of the first main surface from a direction facing the first main surface and a plurality of vias electrically and mechanically coupling the metal structure to the ground plane.

公开(公告)号：US20250046983A1

公开(公告)日：2025-02-06

申请号：US18361952

申请日：2023-07-31

Applicant: Intel Corporation

Inventor： Bala SUBRAMANYA ,  Prakash KURMA RAJU ,  Jayprakash THAKUR ,  Zaman Zaid MULLA ,  Praveen KUMAR ,  Yagnesh Vinodrai WAGHELA ,  Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Harry SKINNER

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q1/52

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

公开(公告)号：US20240314923A1

公开(公告)日：2024-09-19

申请号：US18123049

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Arumanayagam RAJASEKAR ,  Hariharan KALIYAVARATHAN ,  Srinivas REDDY B.M. ,  Yagnesh Vinodrai WAGHELA ,  Piyush BHATT

IPC: H05K1/02

CPC classification number: H05K1/0224 ,  H05K2201/2081

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment, the multi-layer shield comprises a metallic layer with a first surface and a second surface opposite from the first surface, and a conductive adhesive over the first surface of the metallic layer. In an embodiment, a base layer is over the second surface of the metallic layer, where the base layer is electrically insulating.