CIRCUIT DEVICE INSPECTION SYSTEMS USING TEMPERATURE GRADIENTS
    1.
    发明申请
    CIRCUIT DEVICE INSPECTION SYSTEMS USING TEMPERATURE GRADIENTS 审中-公开
    使用温度梯度的电路设备检查系统

    公开(公告)号:US20160274044A1

    公开(公告)日:2016-09-22

    申请号:US14664726

    申请日:2015-03-20

    CPC classification number: G01N25/72

    Abstract: Circuit device inspection system using temperature gradients. In some embodiments, a system may include an infrared camera, first and second temperature sources, controller circuitry to cause the infrared camera to capture an infrared image of a region of a circuit device and to cause the first and second temperature sources to generate first and second temperature outputs to be applied to first and second locations on the circuit device, and processing circuitry to generate temperature gradient data. The temperature gradient data may be indicative of discontinuities in traces in the circuit device.

    Abstract translation: 电路设备检查系统采用温度梯度。 在一些实施例中,系统可以包括红外相机,第一和第二温度源,控制器电路,用于使红外相机捕获电路设备的区域的红外图像,并且使第一和第二温度源首先产生和 要施加到电路装置上的第一和第二位置的第二温度输出,以及用于产生温度梯度数据的处理电路。 温度梯度数据可以指示电路装置中的迹线中的不连续性。

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