Thermal Gradient Battery Monitoring System and Methods

    公开(公告)号:US20240353361A1

    公开(公告)日:2024-10-24

    申请号:US18758223

    申请日:2024-06-28

    申请人: Google LLC

    摘要: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

    DEFECT DETECTION OF EXTRUDED STRIP
    3.
    发明公开

    公开(公告)号:US20240019388A1

    公开(公告)日:2024-01-18

    申请号:US18220713

    申请日:2023-07-11

    IPC分类号: G01N25/72 G08B3/10

    CPC分类号: G01N25/72 G08B3/10

    摘要: A defect detection system and method for detecting the presence of a defect in an extruded strip can include various elements. In examples, a thermal imagining sensor is used to detect a plurality of surface temperatures on a surface of the extruded strip. A processing unit is configured to generate a thermal map of an area of the surface of extruded strip. The processing unit is further configured to determine whether the plurality of surface temperatures are outside a tolerance range, indicating the presence of a defect in the extruded strip. Detecting a defect during the extrusion process can help achieve the goal of reducing manufacturing waste and increasing quality control.

    Thermal Desorption Analysis Automation System and Analysis Method Using Same

    公开(公告)号:US20230333036A1

    公开(公告)日:2023-10-19

    申请号:US18134263

    申请日:2023-04-13

    申请人: WITHTECH INC.

    IPC分类号: G01N25/72 G01N1/44

    摘要: The present invention relates to a Thermal Desorption analysis automation system including an automation system and an analysis method using the same to quickly perform a wafer defect analysis process. The Thermal Desorption analysis automation system includes a heating device that includes a heater for heating a wafer, an analysis device that receives gas containing contaminants desorbed from the heated wafer and analyzes the gas, a coupling part that is disposed outside a chamber and coupled to the wafer, a wafer transfer device that is provided with an arm transferring the coupling part, and a control unit that controls the wafer transfer device to insert the wafer into the chamber and transfer the wafer in the chamber to the outside.

    ACOUSTIC EVENT MONITORING FOR TRIGGERING OF HEALTH SCAN OF A STRUCTURE

    公开(公告)号:US20180340898A1

    公开(公告)日:2018-11-29

    申请号:US15603156

    申请日:2017-05-23

    IPC分类号: G01N25/72 G01N29/24 B64F5/60

    摘要: Apparatus and associated methods relate to generating a trigger signal in response to detection of a triggering acoustic event sensed by one of a distributed network of optical acoustic sensors mechanically coupled to an aircraft structure. Each of the optical acoustic sensors is configured to generate an optical response signal indicative of an acoustic condition detected by the optical acoustic sensor. A controller receives the optical response signals and generates, if a triggering one of the optical response signals is indicative of a triggering acoustic event, a trigger signal. The controller also determines a location of the specific one of the distributed network of optical acoustic sensors that generated the triggering one of the optical response signals. In some embodiments, the trigger signal is sent to a Health & Usage Monitoring System configured to perform a health scan, in response to receiving the trigger signal, of the aircraft structure.