公开(公告)号：US11735551B2

公开(公告)日：2023-08-22

申请号：US16363996

申请日：2019-03-25

Applicant: Intel Corporation

Inventor： Jimin Yao ,  Shawna Liff ,  Xin Yan ,  Numair Ahmed

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/1319 ,  H01L2224/1357 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/171 ,  H01L2224/812 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2924/014

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to an interconnect joint that includes multiple core balls within a solder compound where the multiple core balls are substantially linearly aligned. The multiple core balls, which may include copper or be a polymer, couple with each other within the solder and form a substantially linear alignment during reflow. In embodiments, four or more core balls may be used to achieve a high aspect ratio interconnect joint with a tight pitch.