公开(公告)号：US20240172393A1

公开(公告)日：2024-05-23

申请号：US18428991

申请日：2024-01-31

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Yang Yao ,  Ming Zhang ,  Yuehong Fan ,  Xiang Que ,  Mark MacDonald ,  Casey Jamesen Carte ,  Yue Yang ,  Eric D. McAfee ,  Satyam Saini ,  Suchismita Sarangi ,  Drew Damm ,  Jessica Gullbrand

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

Abstract: Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

公开(公告)号：US20250081396A1

公开(公告)日：2025-03-06

申请号：US18948081

申请日：2024-11-14

Applicant: Intel Corporation

Inventor： Guangying Zhang ,  Chuanlou Wang ,  Yuehong Fan ,  Shaorong Zhou ,  Yang Yao ,  Yingqiong Bu ,  Xiang Que ,  Guoliang Ying

IPC: H05K7/20

Abstract: Immersion cooling systems are disclosed. An example immersion cooling system includes an immersion tank including a cooling fluid and a reservoir to contain a recirculated portion of the cooling fluid. The reservoir is separated from the immersion tank by a height to generate a liquid surface height variance between the cooling fluid in the immersion tank and the cooling fluid in the reservoir. A supply conduit is to fluidly couple the immersion tank and the reservoir. The cooling fluid to be provided from the reservoir to the immersion tank via gravity.

公开(公告)号：US20210345519A1

公开(公告)日：2021-11-04

申请号：US17359405

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Wenbin Tian ,  Yingqiong Bu ,  Yanbing Sun ,  Yang Yao ,  Yuehong Fan ,  Ming Zhang ,  Casey Robert Winkel ,  Jin Yang ,  David Shia ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L23/40

Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.