公开(公告)号：US11917790B2

公开(公告)日：2024-02-27

申请号：US16859202

申请日：2020-04-27

申请人： Intel Corporation

发明人： Prabhakar Subrahmanyam ,  Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan ,  Yi Xia ,  Ying-Feng Pang

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  H05K7/209 ,  H05K7/20209 ,  H05K7/20927

摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

申请人： Intel Corporation

发明人： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC分类号： H05K7/20

CPC分类号： H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

摘要： Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20240172393A1

公开(公告)日：2024-05-23

申请号：US18428991

申请日：2024-01-31

申请人： Intel Corporation

发明人： Sandeep Ahuja ,  Yang Yao ,  Ming Zhang ,  Yuehong Fan ,  Xiang Que ,  Mark MacDonald ,  Casey Jamesen Carte ,  Yue Yang ,  Eric D. McAfee ,  Satyam Saini ,  Suchismita Sarangi ,  Drew Damm ,  Jessica Gullbrand

IPC分类号： H05K7/20

CPC分类号： H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

摘要： Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

公开(公告)号：US20200260613A1

公开(公告)日：2020-08-13

申请号：US16859202

申请日：2020-04-27

申请人： Intel Corporation

发明人： Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan

IPC分类号： H05K7/20

摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

申请人： Intel Corporation

发明人： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC分类号： H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

摘要： Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.

公开(公告)号：US20210345519A1

公开(公告)日：2021-11-04

申请号：US17359405

申请日：2021-06-25

申请人： Intel Corporation

发明人： Wenbin Tian ,  Yingqiong Bu ,  Yanbing Sun ,  Yang Yao ,  Yuehong Fan ,  Ming Zhang ,  Casey Robert Winkel ,  Jin Yang ,  David Shia ,  Mohanraj Prabhugoud

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L23/40

摘要： Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.