-
公开(公告)号：US06748458B2
公开(公告)日：2004-06-08
申请号：US09944529
申请日：2001-08-31
申请人： J. Michael Andrewartha , Martha G. Peterson , Farrukh S. Syed , Brent A. Boudreaux , Richard A. Schumacher , Bryan Wayne Pogor , Eric C. Peterson , Lee Thomas VanLanen , Patrick Wesley Clark , Michael Jay Zalta , Scott Stuart Smith , Kirankumar Chhaganlal Patel
发明人： J. Michael Andrewartha , Martha G. Peterson , Farrukh S. Syed , Brent A. Boudreaux , Richard A. Schumacher , Bryan Wayne Pogor , Eric C. Peterson , Lee Thomas VanLanen , Patrick Wesley Clark , Michael Jay Zalta , Scott Stuart Smith , Kirankumar Chhaganlal Patel
IPC分类号： G06F1314
摘要： The input/output expansion system (“I/O expansion system”) for an external or main computing unit includes a rack; at least one I/O expansion module mounted to the rack, the I/O expansion module comprising at least one I/O circuit card; a utilities control module mounted to the rack, the utilities control module being configured to receive a command from the external computer unit and generating a signal in response to the command for distribution to at least one I/O expansion module; and expansion power chassis mounted to the rack, the an expansion power chassis being electrically connected to a power source and being configured to distribute the power to the at least one I/O expansion module and the utilities control module.
摘要翻译： 用于外部或主要计算单元的输入/输出扩展系统（“I / O扩展系统”）包括机架; 至少一个I / O扩展模块安装到所述机架上，所述I / O扩展模块包括至少一个I / O电路卡; 安装到所述机架的公用事业控制模块，所述公用事业控制模块被配置为从所述外部计算机单元接收命令并响应于所述命令分配给至少一个I / O扩展模块而生成信号; 以及扩展电源机箱，其被安装到所述机架，所述扩展电源机箱电连接到电源并且被配置为将所述电力分配给所述至少一个I / O扩展模块和所述公用事业控制模块。
-
公开(公告)号：US06540531B2
公开(公告)日：2003-04-01
申请号：US09943924
申请日：2001-08-31
申请人： Farrukh S. Syed , Brent A. Boudreaux , Eric C. Peterson , Richard Schumacher , Martha G. Peterson , J. Michael Andrewartha , Jeffrey Todd Haselby , Kirankumar Chhaganlal Patel
发明人： Farrukh S. Syed , Brent A. Boudreaux , Eric C. Peterson , Richard Schumacher , Martha G. Peterson , J. Michael Andrewartha , Jeffrey Todd Haselby , Kirankumar Chhaganlal Patel
IPC分类号： H01R466
CPC分类号： H01R9/0524 , H01R13/74
摘要： A shielded cable assembly contains a hardpoint that resists damage arising from possible collapse of the shielded cable assembly under strong compressional forces that are exerted by a clamp assembly in the form of a separable block having first and second opposed members. The hardpoint contains a conduit that protects a data transfer line or cable bundle by compressing electromagnetic shielding between the conduit and the clamp assembly.
摘要翻译： 屏蔽电缆组件包含硬度点，其抵抗由强力压缩力下的屏蔽电缆组件可能的塌陷而产生的损伤，该强力作用力由具有第一和第二相对构件的可分离块的形式的夹具组件施加。 硬点包含通过压缩导管和夹具组件之间的电磁屏蔽来保护数据传输线或电缆束的导管。
-
公开(公告)号：US06545220B2
公开(公告)日：2003-04-08
申请号：US09944537
申请日：2001-08-31
申请人： Farrukh S. Syed , Brent A. Boudreaux , Eric C. Peterson , Richard Schumacher , Martha G. Peterson , J. Michael Andrewartha
发明人： Farrukh S. Syed , Brent A. Boudreaux , Eric C. Peterson , Richard Schumacher , Martha G. Peterson , J. Michael Andrewartha
IPC分类号： H02G1506
CPC分类号： H05K9/0018 , H02G3/0481 , H05K9/0098
摘要： A shielded cable assembly contains one or more hardpoints that resist damage arising from possible collapse of the shielded cable assembly under strong compressional forces that are exerted by a clamp assembly in the form of a separable block having first and second opposed members. The hardpoint contains a conduit that protects a data transfer line or cable bundle by compressing electromagnetic shielding between the conduit and the clamp assembly. Cable electromagnetic shielding may be exposed over a selected hardpoint for use as needed in a particular application.
摘要翻译： 屏蔽电缆组件包含一个或多个硬点，其抵抗由于由具有第一和第二相对构件的可分离块的形式的夹具组件施加的强的压缩力下由于屏蔽电缆组件可能的塌陷而引起的损坏。 硬点包含通过压缩导管和夹具组件之间的电磁屏蔽来保护数据传输线或电缆束的导管。 有线电磁屏蔽可能暴露在所选的硬点上，以便在特定应用中根据需要使用。
-
公开(公告)号：US06623303B2
公开(公告)日：2003-09-23
申请号：US09945069
申请日：2001-08-31
申请人： Farrukh S. Syed , Eric C. Peterson , Richard Schumacher , Brent Boudreaux , J. Michael Andrewartha , Martha G. Peterson
发明人： Farrukh S. Syed , Eric C. Peterson , Richard Schumacher , Brent Boudreaux , J. Michael Andrewartha , Martha G. Peterson
IPC分类号： H01R903
CPC分类号： H01R13/6485 , H01R9/0518
摘要： The invention provides EMI cable shield termination apparatus. The apparatus includes (a) a cable exit panel coupled to a first electronic system and (b) one or more clamps coupled to the exit panel. The exit panel serves as an interface for one or more cables coupled to the first electronic system; the clamps provide mechanical coupling, and EMI shielding, for the cables to that interface. The exit panel couples to electrical ground such as through connection to the chassis of the first electronic system. The clamps also couple to ground through connection with the exit panel. Preferably, one end of the cables attaches to the clamps, at the interface formed by the exit panel, and the other end of the cables attach to respective ferrules coupled to a second electronics system. Beneficially, the apparatus reduces EMI effects generated from the first electronic system and coupled into the second electronic system. In preferred aspects of the invention, the first and second electronic systems are computers; and each of the clamps forms at least one aperture (“clamp aperture”) to affix to a cable coupled to the first electronic system. The invention facilitates configurable cable shield terminations to meet mechanical requirements of a given installation; that is, a single cable construction permits multiple optional clamp attachment locations to accommodate different separations of the attached equipment.
-
公开(公告)号：US06384325B1
公开(公告)日：2002-05-07
申请号：US09586184
申请日：2000-06-01
IPC分类号： H05K900
CPC分类号： H05K9/0041
摘要： A system for ventilating electronic equipment and suppressing the radiation of electromagnetic interference (EMI) from the electronic equipment. More particularly, the present invention relates to a ventilation port and EMI wave-guide. There is provided corrugated spring member is compressed between a first plate and a second plate so as to define a plurality of ducts, each having a depth and a cross-sectional width. The spring member is in electrical contact with the first plate and the second plate.
摘要翻译： 一种用于通风电子设备并抑制电子设备的电磁干扰（EMI）辐射的系统。 更具体地，本发明涉及通风口和EMI波导。 提供的波纹弹簧构件被压缩在第一板和第二板之间，以便限定多个管道，每个管道具有深度和横截面宽度。 弹簧构件与第一板和第二板电接触。
-
公开(公告)号：US06910271B2
公开(公告)日：2005-06-28
申请号：US10283907
申请日：2002-10-29
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译： 热界面垫由多个热界面板组件构成。 替代的热界面板组件在衬垫内相互旋转约180度。 每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。 热界面板组件被配置为允许热界面垫的厚度变化很大。 垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。 插入板中的开口中的杆可以用于对准板组件并且向板施加压力，从而改善相邻板之间的热导率并大大降低热界面垫的整体热阻。
-
公开(公告)号：US06625026B1
公开(公告)日：2003-09-23
申请号：US10210000
申请日：2002-07-31
IPC分类号： H05K720
CPC分类号： F28F13/00 , F28F2013/005 , H01L21/4882 , H01L23/42 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.
摘要翻译： 热激活的自对准散热器是将至少一个基板上的发热装置热连接到散热体上，其中发热装置可能由于公差叠加而彼此不共面 或与散热器主体平行。 基座附接到基板以支撑散热体。 插头或浮动底座放置在每个发热装置的顶部并且保持在基座内，允许足够的运动使插塞的底表面完全接触发热装置的顶表面。 将一定数量的低熔点温度的导热材料，例如焊料或导热液体放置在每个塞子上，并将散热器主体放置在组件上。 当加热时，热材料熔化，在插头和散热器本体之间形成低阻抗热连接，而与两个器件之间的平面度差异无关。
-
公开(公告)号：US07131199B2
公开(公告)日：2006-11-07
申请号：US11049346
申请日：2005-02-01
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译： 热界面垫由多个热界面板组件构成。 替代的热界面板组件在衬垫内相互旋转约180度。 每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。 热界面板组件被配置为允许热界面垫的厚度变化很大。 垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。 插入板中的开口中的杆可以用于对准板组件并且向板施加压力，改善相邻板之间的热导率并大大降低热界面垫的总体热阻。
-
公开(公告)号：US07117929B2
公开(公告)日：2006-10-10
申请号：US10976033
申请日：2004-10-27
IPC分类号： F28F7/00
CPC分类号： H05K7/20418
摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.
摘要翻译： 建造了第一个散热器，其中包括两组散热片，两组散热片之间具有间隙。 间隙被配置为允许将第二散热器放置在第一散热器的两个翅片组之间。 第一散热器还包括开槽的安装凸耳，以允许第二散热器安装到第一散热器，从而允许由第一和第二散热器冷却的发热装置的叠加公差变化。
-
公开(公告)号：US07345885B2
公开(公告)日：2008-03-18
申请号：US11023213
申请日：2004-12-22
申请人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
发明人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译： 具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。 散热器和第二PCB基本上围绕其中的第一PCB。
-
-
-
-
-
-
-
-
-
搜索结果
107 条记录 (耗时 0.053 秒)
