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公开(公告)号：US07117929B2
公开(公告)日：2006-10-10
申请号：US10976033
申请日：2004-10-27
IPC分类号： F28F7/00
CPC分类号： H05K7/20418
摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.
摘要翻译： 建造了第一个散热器，其中包括两组散热片，两组散热片之间具有间隙。 间隙被配置为允许将第二散热器放置在第一散热器的两个翅片组之间。 第一散热器还包括开槽的安装凸耳，以允许第二散热器安装到第一散热器，从而允许由第一和第二散热器冷却的发热装置的叠加公差变化。
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公开(公告)号：US07475175B2
公开(公告)日：2009-01-06
申请号：US10800837
申请日：2004-03-15
申请人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
发明人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
CPC分类号： G06F15/0216 , G06F15/7864
摘要： An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.
摘要翻译： 一种装置包括多个逻辑上独立的处理器，系统总线以及与多个处理器通信的高速缓存控制和总线桥接器件，使得高速缓存控制和总线桥接器件被逻辑地插入在处理器和系统总线之间，以及 其中所述处理器和高速缓存控制和总线桥接器件以模块形式被布置，使得所述设备是用于标准单处理器模块的插入式替换。
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公开(公告)号：US06873530B2
公开(公告)日：2005-03-29
申请号：US10890937
申请日：2004-07-13
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US06771507B1
公开(公告)日：2004-08-03
申请号：US10355707
申请日：2003-01-31
IPC分类号： H05H720
CPC分类号： H01L23/4338 , H01L23/4006 , H01L2924/0002 , H05K1/0204 , H01L2924/00
摘要： A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.
摘要翻译： 一种用于多芯片印刷电路板的功率模块组件：散热板具有一体地形成在其中的第一和第二接地部分。 插座上装有第一和第二导热销。 功率模块印刷电路板安装在配热板上，并在其中形成有第一和第二间隙孔。 销的第一和第二领域突出穿过第一和第二间隙孔。 多芯片印刷电路板可以安装在功率模块的下方，使得导热针接触第一和第二提供芯片的表面。 提供的芯片在物理上靠近电源模块，并且借助于所提供的芯片和导热引脚之间的接触来提供所提供的芯片的热管理。 多芯片印刷电路板上的空间是保守的。
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公开(公告)号：US06900987B2
公开(公告)日：2005-05-31
申请号：US10890941
申请日：2004-07-13
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US06947286B2
公开(公告)日：2005-09-20
申请号：US11030774
申请日：2005-01-06
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
摘要翻译： 构建第一印刷电路板，其包括被配置为对应于附接到第二印刷电路板的发热装置的一个或多个开口。 第一和第二印刷电路板彼此对准和散热器，使得散热器与第一和第二印刷电路板上的发热电子器件热耦合。 发热装置与一个或多个印刷电路板上的散热垫热耦合。 然后将散热垫与散热器热耦合。 可选地，第一和第二印刷电路板可以通过电连接器彼此电耦合。
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公开(公告)号：US06922340B2
公开(公告)日：2005-07-26
申请号：US10890938
申请日：2004-07-13
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US06862186B2
公开(公告)日：2005-03-01
申请号：US10890626
申请日：2004-07-13
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US06816378B1
公开(公告)日：2004-11-09
申请号：US10425548
申请日：2003-04-28
IPC分类号： H05K720
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US06910271B2
公开(公告)日：2005-06-28
申请号：US10283907
申请日：2002-10-29
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译： 热界面垫由多个热界面板组件构成。 替代的热界面板组件在衬垫内相互旋转约180度。 每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。 热界面板组件被配置为允许热界面垫的厚度变化很大。 垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。 插入板中的开口中的杆可以用于对准板组件并且向板施加压力，从而改善相邻板之间的热导率并大大降低热界面垫的整体热阻。
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