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公开(公告)号：US06628242B1
公开(公告)日：2003-09-30
申请号：US09644876
申请日：2000-08-23
IPC分类号： H01Q1523
CPC分类号： H01P3/12 , H01P1/2005 , H01Q9/0414 , H01Q15/008 , H01Q15/23 , H01Q21/061
摘要： A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies. It can also be used in waveguides that transmit multiple signal frequencies signals in one polarization or that are cross-polarized. As a waveguide it maintains a near-uniform density E and H fields, resulting in near uniform signal power density across the waveguide's cross-section.
摘要翻译： 多层高阻抗结构对多个频率信号呈现高阻抗，每层具有不同的频率。 每个层包括电介质基底，以及在基底顶表面上的辐射元件阵列，例如平行的导电条或导电贴片，在最底层的底表面上具有导电层。 后续层的辐射元件与延伸穿过衬底的导电通孔垂直对准，以将辐射元件连接到接地平面。 每个层在特定信号频率下呈现为E场的一系列并联谐振L-C电路，导致该频率处的高阻抗表面。 新结构可用作微带贴片天线的基板，以在多个频率上提供谐振器和背板之间的最佳电距离。 它也可以用于以一个极化或交叉极化传输多个信号频率信号的波导。 作为波导，它保持近均匀的密度E和H场，导致波导横截面上的近似均匀的信号功率密度。
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公开(公告)号：US07446627B2
公开(公告)日：2008-11-04
申请号：US11395826
申请日：2006-03-31
申请人： Jonathan Bruce Hacker , Moonil Kim
发明人： Jonathan Bruce Hacker , Moonil Kim
CPC分类号： H01Q13/085 , H01P5/1007 , H01P5/107
摘要： High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.
摘要翻译： 高频功率放大模块包括支持耦合到功率放大器的输入的阶梯式阻抗跃迁的介质衬底和连接到功率放大器的输出的对称设置的阶梯式阻抗转变。 功率放大模块在电磁能场中定向，使得输入电磁能通过输入侧阶跃阻抗转换耦合到功率放大器的输入，由放大器放大，并通过输出侧阶跃阻抗转换从模块发射 。 多个功率放大模块可以被组织成阵列以提供功率组合器。 阵列中的功率放大模块可以通过使阵列中的模块分离的隔离阻抗来链接。
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公开(公告)号：US06919862B2
公开(公告)日：2005-07-19
申请号：US10673024
申请日：2003-09-26
CPC分类号： H01P3/12 , H01P1/2005 , H01Q9/0414 , H01Q15/008 , H01Q15/23 , H01Q21/061
摘要： A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies. It can also be used in waveguides that transmit multiple signal frequencies signals in one polarization or that are cross-polarized. As a waveguide it maintains a near-uniform density E and H fields, resulting in near uniform signal power density across the waveguide's cross-section.
摘要翻译： 多层高阻抗结构对多个频率信号呈现高阻抗，每层具有不同的频率。 每个层包括电介质基底，以及阵列的辐射元件，例如基底顶表面上的平行导电条或导电贴片，在最底层的底表面上具有导电层。 后续层的辐射元件与延伸穿过衬底的导电通孔垂直对准，以将辐射元件连接到接地平面。 每个层在特定信号频率下呈现为E场的一系列并联谐振L-C电路，导致该频率处的高阻抗表面。 新结构可用作微带贴片天线的基板，以在多个频率上提供谐振器和背板之间的最佳电距离。 它也可以用于以一个极化或交叉极化传输多个信号频率信号的波导。 作为波导，它保持近均匀的密度E和H场，导致波导横截面上的近似均匀的信号功率密度。
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4.发明授权Plane wave rectangular waveguide high impedance wall structure and amplifier using such a structure 失效平面波矩形波导高阻抗壁结构和放大器采用这样的结构公开(公告)号：US06603357B1
公开(公告)日：2003-08-05
申请号：US09408992
申请日：1999-09-29
IPC分类号： H03F360
CPC分类号： H01P3/122 , H01Q3/46 , H01Q15/008 , H01Q15/22
摘要： An improved waveguide wall structure and improved waveguide using the new wall structure as the interior walls of the waveguide. The wall structure comprises a sheet of dielectric material, a series of parallel conductive strips on one side of the dielectric material and a layer of conductive material on the other side. Multiple conductive vias are also included through the dielectric material and between the conductive layer and conductive strips. The new wall structure presents as a series of parallel L-C circuits to a transverse E field at resonant frequency, resulting in a high impedance surface. The wall structure can be used in waveguides that transmit a signal in one polarization or signals that are cross polarized. The new waveguide maintains a near uniform density E field and H field component, resulting in near uniform signal power density across the waveguide cross section.
摘要翻译： 改进的波导壁结构和改进的波导使用新的壁结构作为波导的内壁。 壁结构包括电介质材料片，电介质材料一侧上的一系列平行导电条和另一侧的导电材料层。 还通过电介质材料以及导电层和导电带之间还包括多个导电孔。 新的壁结构以共振频率呈现为一系列平行L-C电路到横向E场，导致高阻抗表面。 壁结构可以用于传输一个极化信号的波导或交叉极化的信号。 新的波导保持近均匀的密度E场和H场分量，导致波导横截面上的近似均匀的信号功率密度。
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5.发明申请High Throughput Screening Method of Binding Inhibitor Between caspase3 and XIAP and Binding Inhibitor Screened Thereby 审中-公开通过筛选caspase3和XIAP结合抑制剂之间的结合抑制剂的高通量筛选方法公开(公告)号：US20090318376A1
公开(公告)日：2009-12-24
申请号：US12304766
申请日：2006-06-12
申请人： Bong Hyun Chung , Kwang-Hee Son , Moonil Kim , Kyoungsook Park , Byoung-Mog Kwon , Hyun Jung Junn , Dong Cho Han , Sun-Hee Jeon
发明人： Bong Hyun Chung , Kwang-Hee Son , Moonil Kim , Kyoungsook Park , Byoung-Mog Kwon , Hyun Jung Junn , Dong Cho Han , Sun-Hee Jeon
IPC分类号： A61K31/702 , G01N33/573 , C07H15/24
CPC分类号： A61K31/702 , G01N33/574 , G01N2333/96469 , G01N2500/02
摘要： The present invention relates to a high throughput screening method of a binding inhibitor between caspase3 and xIAP and chromomycin screened using the same, and more specifically, the present invention provides a method for screening anticancer substance, the method comprising the steps of reacting caspase3 or xIAP and candidate inhibitors of the binding between caspase3 and xIAP on a biochip for detecting caspase3:xIAP interaction, and selecting a candidate substance inhibiting the binding of caspase3 to xIAP as an anticancer substance, and an anticancer agent inhibiting caspase3:xIAP binding, which is screened by the above method. According to present invention, it is possible to develop a target-oriented anticancer agent focused on xIAP and caspase3, apoptosis-related proteins and thus it can be applied to tailored medication and combination therapy. Moreover, glycoside antibiotic chromomycin, screened by the present invention has inhibitory activity of the binding between xIAP and caspase3 involved in apoptosis, so that it can be used as a therapeutic agent for myelogenous leukemia and solid tumors.
摘要翻译： 本发明涉及使用其筛选的胱天蛋白酶3和xIAP之间的结合抑制剂的高通量筛选方法，更具体地说，本发明提供了筛选抗癌物质的方法，所述方法包括以下步骤：使半胱天冬酶3或xIAP 以及用于检测胱天蛋白酶3：xIAP相互作用的生物芯片上的半胱天冬酶3和xIAP之间的结合的候选抑制剂，并且选择抑制半胱天冬酶3与作为抗癌物质的xIAP的结合的候选物质，以及抑制胱天蛋白酶3的抗癌剂：xIAP结合 通过上述方法。 根据本发明，可以开发聚焦于xIAP和caspase3的靶向抗癌剂，凋亡相关蛋白，因此可以应用于定制药物和联合治疗。 此外，通过本发明筛选的糖苷抗生素chromomycin具有抑制参与凋亡的xIAP和半胱天冬酶3之间的结合的活性，因此可以用作骨髓性白血病和实体瘤的治疗剂。
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6.发明授权Antenna, radio device, method of designing antenna, and method of measuring operating frequency of antenna 有权天线，无线电设备，天线设计方法以及测量天线工作频率的方法公开(公告)号：US07330161B2
公开(公告)日：2008-02-12
申请号：US11528614
申请日：2006-09-28
申请人： Kazuoki Matsugatani , Makoto Tanaka , Dowon Kim , Moonil Kim
发明人： Kazuoki Matsugatani , Makoto Tanaka , Dowon Kim , Moonil Kim
CPC分类号： H01Q9/065 , H01Q9/0421 , H01Q15/0053 , H01Q15/008 , H01Q21/065
摘要： An antenna comprises a first conductive layer, a second conductive layer and an LC resonance circuit. The first conductive layer has plural elements and is disposed adjacently to each other. The second conductive layer is disposed at a predetermined distance from the first conductive layer via a dielectric substrate. The LC resonance circuit comprises connection for electrically connecting the elements and the second conductive layer. The LC resonance circuit takes a resonance state in which impedance becomes high in the operating frequency of the antenna. Of the plural elements, a power feeding section is provided in each of any two adjacent elements. Power is fed to the power feeding sections during transmission so that signals of the operating frequency are opposite in phase, and signals of the operating frequency inputted to the antenna are outputted in opposite phase from the power feeding sections during reception.
摘要翻译： 天线包括第一导电层，第二导电层和LC谐振电路。 第一导电层具有多个元件并且彼此相邻地设置。 第二导电层经由电介质基板与第一导电层隔开预定距离。 LC谐振电路包括用于电连接元件和第二导电层的连接。 LC谐振电路采用谐振状态，其中天线的工作频率中阻抗变高。 在多个元件中，在任何两个相邻元件中的每一个中设置供电部。 在发送期间将功率馈送到馈电部分，使得工作频率的信号相位相反，并且在接收期间输入到天线的工作频率的信号与馈电部分以相反的相位输出。
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公开(公告)号：US20060145872A1
公开(公告)日：2006-07-06
申请号：US11300600
申请日：2005-12-15
申请人： Makoto Tanaka , Kazuoki Matsugatani , Moonil Kim , Won Ho Kim
发明人： Makoto Tanaka , Kazuoki Matsugatani , Moonil Kim , Won Ho Kim
CPC分类号： G06K19/07771 , G06K19/07749 , H01L23/49855 , H01L2924/0002 , H01L2924/00
摘要： A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.
摘要翻译： 用于透射的第一金属板和用于透射的第二金属板分别紧密地附接到电介质体的第一表面和第二表面。 第一金属板的外边缘经由介电体基本对称地面对第二金属板的外边缘。 用于匹配的金属板布置在形成在第二金属板上的孔内，其中狭缝形成有孔的内壁，并且固定到电介质体。 用于匹配的金属板经由穿过介电体的通孔与第一金属板电连接。 将IC芯片表面安装以将第二金属板与金属板连接以进行匹配。
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公开(公告)号：US09147923B2
公开(公告)日：2015-09-29
申请号：US13420267
申请日：2012-03-14
申请人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
发明人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
CPC分类号： H01P5/10
摘要： There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.
摘要翻译： 提供了一种差模放大器驱动电路，包括：第一端口，其一端连接到单个信号; 第二端口，其一端连接到差分信号; 一端接地的第一传输线; 以及第三端口，其一端连接到第一传输线，另一端连接到差分信号。
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公开(公告)号：US08749434B2
公开(公告)日：2014-06-10
申请号：US12841884
申请日：2010-07-22
申请人： Myeong Woo Han , Jung Aun Lee , Chul Gyun Park , Seung Ho Choi , Moonil Kim , Kook Joo Lee
发明人： Myeong Woo Han , Jung Aun Lee , Chul Gyun Park , Seung Ho Choi , Moonil Kim , Kook Joo Lee
IPC分类号： H01Q1/38
CPC分类号： H01Q1/40 , H01Q9/0485 , H01Q13/106 , H01Q13/18
摘要： A dielectric resonator antenna is disclosed that includes a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked. The dielectric resonator antenna also includes a first conductor plate that has an opening part on the upper portion of the top insulating layer of the multi-layer substrate and a second conductor plate that is formed on the lower portion of the bottom insulating layer from the first conductor plate. The insulating layer is formed with at least two stacked layers and is disposed at a position corresponding to the opening part. The dielectric resonator antenna also includes a plurality of first metal via holes, a feeding part and a matching substrate that is stacked on the opening part and is stacked with at least one insulating layer.
摘要翻译： 公开了一种介质谐振器天线，其包括多层基板，多层绝缘层和导体层交替层叠在该多层基板上。 介质谐振器天线还包括：第一导体板，其在多层基板的顶部绝缘层的上部具有开口部分;以及第二导体板，其形成在底部绝缘层的下部， 导体板。 绝缘层形成有至少两个层叠层，并且设置在与开口部对应的位置。 介质谐振器天线还包括多个第一金属通孔，馈电部分和匹配基板，其堆叠在开口部分上并与至少一个绝缘层堆叠。
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公开(公告)号：US20110133991A1
公开(公告)日：2011-06-09
申请号：US12710163
申请日：2010-02-22
申请人： Jung Aun Lee , Moonil Kim , Kook Joo Lee , Chul Gyun Park
发明人： Jung Aun Lee , Moonil Kim , Kook Joo Lee , Chul Gyun Park
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0485 , H01Q13/00
摘要： Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment.
摘要翻译： 公开了一种嵌入多层基板中的介质谐振器天线，其包括多层基板，具有开口的第一导体板，形成在最下层绝缘层底部的第二导体板， 第一导体板，以预定间隔穿过开口周围的多个金属通孔，以及用于将频率信号传输到由第一导体板，第二导体板和第二导体板限定的金属边界嵌入的介质谐振器的馈电器 多个金属通孔，因此对制造误差和外部环境的敏感性低。
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