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公开(公告)号：US20210114163A1
公开(公告)日：2021-04-22
申请号：US17036062
申请日：2020-09-29
Applicant: Samsung Display Co., LTD. , KCTECH CO.,LTD.
Inventor： Seung Bae KANG , Sung Hyeon PARK , Jung Gun NAM , Joon-Hwa BAE , Kyung Bo LEE , Keun Woo LEE , Woo Jin CHO , Byoung Kwon CHOO
Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
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公开(公告)号：US20240286176A1
公开(公告)日：2024-08-29
申请号：US18469540
申请日：2023-09-18
Applicant: KCTECH CO., LTD.
Inventor： Keun Woo LEE , Dae Jung KANG , Byeong Jo PARK
CPC classification number: B08B5/043 , B08B3/022 , B08B5/023 , H01L21/67051 , B08B2203/0211
Abstract: A substrate cleaning apparatus includes a stage on which a substrate is placed, a support unit configured to support the substrate and to rotate the substrate, and a cleaning unit configured to spray a dual fluid to clean the substrate, wherein the cleaning unit may include a spray nozzle including a spray hole opened toward the stage and configured to spray a dual fluid through the spray hole, a cover that may include an inlet surrounding at least a partial area of an outer circumferential surface of the spray hole, that may surround at least a partial area of an outer circumferential surface of the spray nozzle, and that may be spaced apart from the spray nozzle by a predetermined distance, and an air flow passage formed in a space between the cover and the spray nozzle and through which air sucked from the inlet flows.
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