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公开(公告)号：US20220080502A1
公开(公告)日：2022-03-17
申请号：US17019937
申请日：2020-09-14
Applicant: KEMET Electronics Corporation
Inventor： James Allen Fife , Liliana Vela , Mary Lou Lindstrom
Abstract: Provided is a process for providing a flake powder characterized by a particle size of −40 mesh to +200 mesh; a Scott density of at least 1.458 g/cm3; and a flow of at least 1 g/s. The process includes introducing a milled flake powder in a solvent to a first dryer; removing the solvent at a temperature below a melting point of the solvent under a reduced atmosphere to obtain a partially dry flake powder; and introducing the partially dry flake powder to a second dryer to form flake powder wherein particles of partially dry flake powder are heated and simultaneously subjected to an uncorrelated motion relative to adjacent particles.
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公开(公告)号：US20170084397A1
公开(公告)日：2017-03-23
申请号：US15263812
申请日：2016-09-13
Applicant: KEMET Electronics Corporation
Inventor： Keith Lee Moore , Philip M. Lessner , Chris Stolarski , James Allen Fife , Liancai Ning
CPC classification number: H01G9/0029 , H01G9/0032 , H01G9/012 , H01G9/052 , H01G9/07
Abstract: A method for forming a high aspect ratio sintered powder anode with low warpage, an anode made thereby and a cathode comprising the anode are provided. The method comprises placing a multiplicity of anode precursors on a forming substrate in a common plane wherein no more than 10% of the anode precursors are out of the common plane. A second substrate is then placed over the forming substrate with the anode precursors between the forming substrate and the second substrate thereby forming a sandwiched assembly. The sandwiched assembly is heated to a sintering temperature of the anode precursors thereby forming the sintered powder anodes. The and sintered powder anodes are removed from between the forming substrate and the second substrate.
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