公开(公告)号：US20230307265A1

公开(公告)日：2023-09-28

申请号：US17898143

申请日：2022-08-29

Applicant: KIOXIA CORPORATION

Inventor： Takaumi MORITA ,  Hiroshi FUJITA ,  Tatsuhiko KOIDE ,  Naomi YANAI ,  Tsubasa WATANABE

IPC: H01L21/67

CPC classification number: H01L21/67086

Abstract: According to one embodiment, a substrate processing apparatus includes a processing tank configured to store a chemical solution for processing a substrate by immersion in a chemical solution. The substrate is held by a holding member during the processing. A lid is configured to open and close an upper end portion of the processing tank. The lid has a first bubble dispensing pipe formed or integrated therein. The first bubble dispensing pipe is configured to dispense a gas into the processing tank. A bottom surface side of the lid on a processing tank side may come into direct contact with the chemical solution in some examples. The first bubble dispensing pipe may dispense an inert gas into the chemical solution to improve process stability or the like.