公开(公告)号：US10190868B2

公开(公告)日：2019-01-29

申请号：US14826079

申请日：2015-08-13

Applicant: KLA-Tencor Corporation

Inventor： Liequan Lee ,  Raphael Jean Michel Marie Getin ,  Meng Cao ,  Leonid Poslavsky ,  Torsten Rudolf Kaack ,  Hong Qiu

IPC: G01B11/02 ,  G06N5/02 ,  G03F7/20

Abstract: A metrology system, method, and computer program product that employ automatic transitioning between utilizing a library and utilizing regression for measurement processing are provided. In use, it is determined, by the metrology system, that a predetermined condition has been met. In response to determining that the predetermined condition has been met, the metrology system automatically transitions between utilizing a library and utilizing regression for measurement processing.

公开(公告)号：US20160320315A1

公开(公告)日：2016-11-03

申请号：US14826079

申请日：2015-08-13

Applicant: KLA-Tencor Corporation

Inventor： Liequan Lee ,  Raphael Jean Michel Marie Getin ,  Meng Cao ,  Leonid Poslavsky ,  Torsten Rudolf Kaack ,  Hong Qiu

IPC: G01N21/95 ,  G01B11/02

CPC classification number: G01B11/02 ,  G03F7/70625 ,  G06N5/02

Abstract: A metrology system, method, and computer program product that employ automatic transitioning between utilizing a library and utilizing regression for measurement processing are provided. In use, it is determined, by the metrology system, that a predetermined condition has been met. In response to determining that the predetermined condition has been met, the metrology system automatically transitions between utilizing a library and utilizing regression for measurement processing.

Abstract translation: 提供了一种使用库之间自动转换并利用回归进行测量处理的计量系统，方法和计算机程序产品。 在使用中，由计量系统确定满足预定条件。 响应于确定已经满足预定条件，计量系统在利用库和利用用于测量处理的回归之间自动转换。

公开(公告)号：US10393647B1

公开(公告)日：2019-08-27

申请号：US14578245

申请日：2014-12-19

Applicant: KLA-Tencor Corporation

Inventor： Qiang Jimmy Zhao ,  Liequan Lee ,  Jonathan Ian Iloreta ,  Hong Qiu ,  Leonid Poslavsky

IPC: G01N21/25

Abstract: A system, method, and computer program product are provided for automatically determining a parameter causing an abnormal semiconductor metrology measurement. In use, an abnormal semiconductor metrology measurement measured from a fabricated semiconductor component is received. At least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement is then automatically determined by one or more hardware processors. In particular, the one or more hardware processors determine a subset of parameters of the fabricated semiconductor component as potential sources of the abnormal semiconductor metrology measurement, rank the parameters in the determined subset of parameters, select an Nth number of the parameters in the determined subset of parameters in accordance with the ranking, and then analyze each of the selected parameters to identify one or more of the selected parameters as the at least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement.