公开(公告)号：US10365639B2

公开(公告)日：2019-07-30

申请号：US15248523

申请日：2016-08-26

Applicant: KLA-Tencor Corporation

Inventor： Shabnam Ghadar ,  Sina Jahanbin ,  Himanshu Vajaria ,  Bradley Ries

IPC: G05B19/408 ,  G06N5/02 ,  G05B19/418 ,  H01L21/66 ,  G06N20/00

Abstract: Feature extraction and classification is used for process window monitoring. A classifier, based on combinations of metrics of masked die images and including a set of significant combinations of one or more segment masks, metrics, and wafer images, is capable of detecting a process non-compliance. A process status can be determined using a classifier based on calculated metrics. The classifier may learn from nominal data.

公开(公告)号：US09734568B2

公开(公告)日：2017-08-15

申请号：US14630252

申请日：2015-02-24

Applicant: KLA-TENCOR CORPORATION

Inventor： Himanshu Vajaria ,  Sina Jahanbin ,  Bradley Ries ,  Mohan Mahadevan

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  G06K9/48 ,  G06K9/62 ,  G06T7/13 ,  G06T7/62

CPC classification number: G06T7/0004 ,  G01N21/9503 ,  G06K9/481 ,  G06K9/6204 ,  G06K2209/19 ,  G06T7/0006 ,  G06T7/13 ,  G06T7/62 ,  G06T2207/10024 ,  G06T2207/30148

Abstract: Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.

公开(公告)号：US20170192411A1

公开(公告)日：2017-07-06

申请号：US15248523

申请日：2016-08-26

Applicant: KLA-Tencor Corporation

Inventor： Shabnam Ghadar ,  Sina Jahanbin ,  Himanshu Vajaria ,  Bradley Ries

IPC: G05B19/408 ,  G06N5/02

CPC classification number: G05B19/41875 ,  G05B2219/37224 ,  G06N20/00 ,  H01L22/12 ,  H01L22/20 ,  Y02P90/22

Abstract: Feature extraction and classification is used for process window monitoring. A classifier, based on combinations of metrics of masked die images and including a set of significant combinations of one or more segment masks, metrics, and wafer images, is capable of detecting a process non-compliance. A process status can be determined using a classifier based on calculated metrics. The classifier may learn from nominal data.