公开(公告)号：US20150234379A1

公开(公告)日：2015-08-20

申请号：US14209198

申请日：2014-03-13

Applicant: KLA-Tencor Corporation

Inventor： Himanshu Vajaria ,  Tommaso Torelli ,  Bradley Ries ,  Mohan Mahadevan

IPC: G05B19/418 ,  H01L21/02

CPC classification number: G06T7/0004 ,  G06T2207/20076 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20 ,  Y02P90/14

Abstract: Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.

Abstract translation: 公开了用于监测工艺工具条件的方法和系统。 该方法将单个晶圆，多个晶圆和多个批次信息统一组合在一起，作为自定义分类引擎的输入，可以消耗单个或多个扫描，通道，晶圆和批次来确定过程工具状态。

公开(公告)号：US20200098101A1

公开(公告)日：2020-03-26

申请号：US16180957

申请日：2018-11-05

Applicant: KLA-Tencor Corporation

Inventor： Anuj Pandey ,  Bradley Ries ,  Himanshu Vajaria ,  Yong Zhang ,  Rahul Lakhawat

IPC: G06T7/00 ,  G06T3/40 ,  G06N3/08 ,  G06N3/04

Abstract: A system for analyzing a sample includes an inspection sub-system and at least one controller. The inspection sub-system is configured to scan a sample to collect a first plurality of sample images having a first image resolution. The controller is configured to generate a defect list based on the first plurality of sample images. The controller is further configured to input images corresponding to the defect list into a neural network that is trained with source data including sample images having the first image resolution and sample images having a second image resolution higher than the first image resolution. The controller is further configured to generate a second plurality of sample images with the neural network based on the images corresponding to the defect list, where the second plurality of sample images have the second image resolution and correspond to the defect list.

公开(公告)号：US10949964B2

公开(公告)日：2021-03-16

申请号：US16180957

申请日：2018-11-05

Applicant: KLA-Tencor Corporation

Inventor： Anuj Pandey ,  Bradley Ries ,  Himanshu Vajaria ,  Yong Zhang ,  Rahul Lakhawat

IPC: G06T7/00 ,  G06T3/40 ,  G06N3/08 ,  G06N3/04

Abstract: A system for analyzing a sample includes an inspection sub-system and at least one controller. The inspection sub-system is configured to scan a sample to collect a first plurality of sample images having a first image resolution. The controller is configured to generate a defect list based on the first plurality of sample images. The controller is further configured to input images corresponding to the defect list into a neural network that is trained with source data including sample images having the first image resolution and sample images having a second image resolution higher than the first image resolution. The controller is further configured to generate a second plurality of sample images with the neural network based on the images corresponding to the defect list, where the second plurality of sample images have the second image resolution and correspond to the defect list.

公开(公告)号：US10365639B2

公开(公告)日：2019-07-30

申请号：US15248523

申请日：2016-08-26

Applicant: KLA-Tencor Corporation

Inventor： Shabnam Ghadar ,  Sina Jahanbin ,  Himanshu Vajaria ,  Bradley Ries

IPC: G05B19/408 ,  G06N5/02 ,  G05B19/418 ,  H01L21/66 ,  G06N20/00

Abstract: Feature extraction and classification is used for process window monitoring. A classifier, based on combinations of metrics of masked die images and including a set of significant combinations of one or more segment masks, metrics, and wafer images, is capable of detecting a process non-compliance. A process status can be determined using a classifier based on calculated metrics. The classifier may learn from nominal data.

公开(公告)号：US10290088B2

公开(公告)日：2019-05-14

申请号：US14209198

申请日：2014-03-13

Applicant: KLA-Tencor Corporation

Inventor： Himanshu Vajaria ,  Tommaso Torelli ,  Bradley Ries ,  Mohan Mahadevan

IPC: G06T7/00 ,  H01L21/66

Abstract: Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.

公开(公告)号：US09734568B2

公开(公告)日：2017-08-15

申请号：US14630252

申请日：2015-02-24

Applicant: KLA-TENCOR CORPORATION

Inventor： Himanshu Vajaria ,  Sina Jahanbin ,  Bradley Ries ,  Mohan Mahadevan

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  G06K9/48 ,  G06K9/62 ,  G06T7/13 ,  G06T7/62

CPC classification number: G06T7/0004 ,  G01N21/9503 ,  G06K9/481 ,  G06K9/6204 ,  G06K2209/19 ,  G06T7/0006 ,  G06T7/13 ,  G06T7/62 ,  G06T2207/10024 ,  G06T2207/30148

Abstract: Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.

公开(公告)号：US20170192411A1

公开(公告)日：2017-07-06

申请号：US15248523

申请日：2016-08-26

Applicant: KLA-Tencor Corporation

Inventor： Shabnam Ghadar ,  Sina Jahanbin ,  Himanshu Vajaria ,  Bradley Ries

IPC: G05B19/408 ,  G06N5/02

CPC classification number: G05B19/41875 ,  G05B2219/37224 ,  G06N20/00 ,  H01L22/12 ,  H01L22/20 ,  Y02P90/22

Abstract: Feature extraction and classification is used for process window monitoring. A classifier, based on combinations of metrics of masked die images and including a set of significant combinations of one or more segment masks, metrics, and wafer images, is capable of detecting a process non-compliance. A process status can be determined using a classifier based on calculated metrics. The classifier may learn from nominal data.

公开(公告)号：US09569834B2

公开(公告)日：2017-02-14

申请号：US14746820

申请日：2015-06-22

Applicant: KLA-TENCOR CORPORATION

Inventor： Himanshu Vajaria ,  Shabnam Ghadar ,  Tommaso Torelli ,  Bradley Ries ,  Mohan Mahadevan ,  Stilian Pandev

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/11 ,  G06T7/001 ,  G06T2207/30148

Abstract: Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.

Abstract translation: 公开了用于基于图像自动检测晶片制造过程的状态的方法和装置。 这些方法有利地使用段掩模来增强图像的信噪比。 然后针对段掩码变化计算度量，以便确定预测过程不合规性的段掩码和度量的一个或多个组合。 作为过程的结果可以生成模型。 在另一个实施例中，一种方法使用模型来监视合规性的过程。