公开(公告)号：US20240055694A1

公开(公告)日：2024-02-15

申请号：US17638182

申请日：2021-10-19

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sung Jin Kim ,  Young Jong Lee ,  Jonghyun Lim

IPC: H01M10/6554 ,  F28F13/10 ,  H01M10/613 ,  H01M50/204

CPC classification number: H01M10/6554 ,  F28F13/10 ,  H01M10/613 ,  H01M50/204

Abstract: The present disclosure relates to a pulsating heat pipe-based battery cooling module and a battery unit including the same. The cooling module using the pulsating heat pipe may include: a plurality of heating plates which are arranged in parallel such that both sides or one side of the heating plates contact a plurality of battery cells, while forming a space in which the plurality of battery cells are accommodatable; at least one cooling plate which allows a coolant to flow; and a plurality of channels which are in contact with the plurality of heating plates and the at least one cooling plate, have a sealed tube shape and a working fluid filled in a portion of the sealed tube shape in such a way as to function as the pulsating heat pipe. The proposed cooling module minimizes the temperature difference within the battery cell and efficiently absorbs the heat, thereby reducing the overall temperature of the battery cell.

公开(公告)号：US11204203B2

公开(公告)日：2021-12-21

申请号：US16563347

申请日：2019-09-06

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sung Jin Kim ,  Chuljae Jung ,  Jonghyun Lim

IPC: F28D15/00 ,  F28D15/02 ,  H05K7/20

Abstract: Provided are a flat plate pulsating heat pipe having flexibility and having an improved sealing ability so as not to leak a working fluid therein, and a manufacturing method thereof. The flat plate pulsating heat pipe includes a base part having an upper surface or a lower surface which is plasma-treated, wherein the base part has a plurality of channels formed therein and both end portions of each of the channels are bent and connected to each other to form a closed-loop type or a closed type; and a pair of surface films bonded to an upper portion and a lower portion of the base part and bonded to each other at an outer portion of the base part to seal the channels.

公开(公告)号：US10264707B2

公开(公告)日：2019-04-16

申请号：US15518814

申请日：2015-05-22

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sung Jin Kim ,  Gi Hwan Kwon

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04 ,  F28F13/10 ,  H01L23/427

Abstract: Disclosed is a flat plate pulsating heat pipe (FP-PHP) serving as a power-free high efficiency heat transfer system for small electronic devices such as mobile phones and laptop computers. The FP-PHP is manufactured using MEMS technology and configured to have a single-turn loop or a multi-turn loop, each having a single diameter channel or a dual diameter channel. Further, since a working fluid used in a flat plate pulsating heat pipe exhibits different characteristics according to the main working temperature, provided is a flat plate pulsating heat pipe which includes a working fluid having optimum efficiency in the main working temperature. In addition, the flat plate pulsating heat pipe applicable at various installation angles, of the present invention which is for achieving the above purpose, includes: a silicon lower wafer plate having a rectangular shape; a capillary tube comprising a channel which has a constant depth on the upper surface of the silicon wafer lower plate and is formed in the form of a straight line along the longitudinal direction of the silicon wafer lower plate, wherein the channel forms a closed loop which is bent at both ends of the silicon wafer lower plate and is connected; a wafer upper plate which is coupled on top of the silicon wafer lower plate and seals the capillary tube; and a working fluid filled inside the capillary tube, wherein the capillary tube is made of a combination of a dual-diameter tube including a pair of channels having different widths and a single diameter tube including a pair of channels having the same width.

公开(公告)号：US10436520B2

公开(公告)日：2019-10-08

申请号：US15941625

申请日：2018-03-30

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sung Jin Kim ,  Wookyoung Kim

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427

Abstract: The plate pulsating heat spreader according to the present disclosure may lower the degree of superheat to thereby allow nucleation to easily occur by including the cavities, thereby preventing a sudden temperature rise of an evaporator and having improved thermal performance. The pulsating heat spreader includes fluid channels and cavities.

公开(公告)号：US11651214B2

公开(公告)日：2023-05-16

申请号：US16764677

申请日：2018-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Hyun Soo Choi ,  Chang D. Yoo ,  Sung Hun Kang ,  Jun Yeong Kim ,  Sung Jin Kim

IPC: G06N3/08 ,  G06N20/20 ,  G06F18/21 ,  G06N3/045

CPC classification number: G06N3/08 ,  G06F18/217 ,  G06N3/045 ,  G06N20/20

Abstract: An artificial intelligence (AI) system capable of simulating functions of a human brain, such as recognition and judgment, by using the machine learning algorithm such as deep learning, and an application thereof are provided. A method of learning multi-modal data according to the AI system and an application thereof includes: obtaining first context information representing a characteristic of a first signal and second context information representing a characteristic of a second signal by using a first learning network model; obtaining hidden layer information based on the first context information and the second context information by using a second learning network model; obtaining a correlation value representing a relation degree between the hidden layer information by using the second learning network model; and learning the hidden layer information in which the correlation value is derived as a maximum value.

公开(公告)号：US20210307201A1

公开(公告)日：2021-09-30

申请号：US17211249

申请日：2021-03-24

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sung Jin Kim ,  Jong Hyun Lim

IPC: H05K7/20 ,  G06F30/17 ,  G06F30/28

Abstract: The present disclosure relates to a method for designing a channel structure of a pulsating heat pipe and a heat dissipation device using the same. The pulsating heat pipe may have the channel structure designed such that at least some channels of the plurality of channels are merged and channels of which the number is greater than the half of the plurality of channels overlap at least partially with the heating portion area. The heat dissipation device may efficiently perform heat dissipation in a local heating condition.