公开(公告)号：US20240379649A1

公开(公告)日：2024-11-14

申请号：US18632390

申请日：2024-04-11

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Marianne Berolini ,  Jessica Parry ,  Jonathan Shealy

IPC: H01L27/01 ,  H01L21/48 ,  H05K1/11 ,  H05K1/16

Abstract: Single layer capacitors and circuit boards having such capacitors are provided. A circuit board can include a circuit board substrate having a mounting surface and a single layer capacitor at least partially embedded therein. The single layer capacitor includes a first conductive layer formed over at least a portion of a substrate first surface and a second conductive layer formed over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns. A method of forming a single layer capacitor includes depositing a first conductive layer over at least a portion of a substrate first surface and depositing a second conductive layer over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns.