公开(公告)号：US20080032489A1

公开(公告)日：2008-02-07

申请号：US11833605

申请日：2007-08-03

Applicant: Kevin Formosa

Inventor： Kevin Formosa

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.

Abstract translation: 一种用于由柔性粘性基板支撑的单一晶片的芯片接合设备的可移动的晶片扩展器，该可移除的晶片扩展器设置有第一环形构件以与第二环构件联接，用于在安装之前将柔性粘性基板远程扩展 晶片扩展器到芯片粘合设备上。

公开(公告)号：US08837754B2

公开(公告)日：2014-09-16

申请号：US13402761

申请日：2012-02-22

Applicant: Kevin Formosa ,  Mark Anthony Azzopardi ,  Mario Francesco Cortese ,  Mark Shaw ,  Alex Gritti ,  Luca Maggi ,  Filippo David

Inventor： Kevin Formosa ,  Mark Anthony Azzopardi ,  Mario Francesco Cortese ,  Mark Shaw ,  Alex Gritti ,  Luca Maggi ,  Filippo David

IPC: H04R25/00 ,  H04R19/00 ,  B81C1/00 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/093 ,  B81C1/0023 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract translation: MEMS传感器具有微机械感测结构和封装。 该封装设置有承载第一电连接元件的基板，并具有耦合到该基板的盖，以限定其中容纳有微机械感测结构的内部空腔。 盖子由以下部分形成：盖层，具有彼此相对设置的第一表面和第二表面，第一表面限定包装的外表面，第二表面面向包装内的基材; 以及壁结构，其设置在所述盖层和所述基板之间，并且具有联接到所述基板的耦合面。 至少第一电气部件耦合到盖层的第二表面，在封装内部，并且壁结构的耦合面承载第二电连接元件，电连接到第一电气部件和第一电连接 元素。

公开(公告)号：US07675170B2

公开(公告)日：2010-03-09

申请号：US11833605

申请日：2007-08-03

Applicant: Kevin Formosa

Inventor： Kevin Formosa

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.

Abstract translation: 一种用于由柔性粘性基板支撑的单一晶片的芯片接合设备的可移动的晶片扩展器，该可移除的晶片扩展器设置有第一环形构件以与第二环构件联接，用于在安装之前将柔性粘性基板远程扩展 晶片扩展器到芯片粘合设备上。

公开(公告)号：US20120153771A1

公开(公告)日：2012-06-21

申请号：US13402761

申请日：2012-02-22

Applicant: Kevin Formosa ,  Mark Anthony Azzopardi ,  Mario Francesco Cortese ,  Mark Shaw ,  Alex Gritti ,  Luca Maggi ,  Filippo David

Inventor： Kevin Formosa ,  Mark Anthony Azzopardi ,  Mario Francesco Cortese ,  Mark Shaw ,  Alex Gritti ,  Luca Maggi ,  Filippo David

IPC: H02N1/00 ,  H01R43/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/093 ,  B81C1/0023 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract translation: MEMS传感器具有微机械感测结构和封装。 该封装设置有承载第一电连接元件的基板，并具有耦合到该基板的盖，以限定其中容纳有微机械感测结构的内部空腔。 盖子由以下部分形成：盖层，具有彼此相对设置的第一表面和第二表面，第一表面限定包装的外表面，第二表面面向包装内的基材; 以及壁结构，其设置在所述盖层和所述基板之间，并且具有联接到所述基板的耦合面。 至少第一电气部件耦合到盖层的第二表面，在封装内部，并且壁结构的耦合面承载第二电连接元件，电连接到第一电部件和第一电连接 元素。