Substrate holding device and polishing apparatus
    1.
    发明授权
    Substrate holding device and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US07635292B2

    公开(公告)日:2009-12-22

    申请号:US11791218

    申请日:2005-12-06

    IPC分类号: B24B29/00

    CPC分类号: B24B37/30

    摘要: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.

    摘要翻译: 根据本发明的基板保持装置包括与基板的后表面接触的弹性膜,用于固定弹性膜的至少一部分的安装构件和用于保持弹性膜的周边部分的保持环 该基底与弹性膜接触。 弹性膜包括至少一个突出部分,并且附接构件包括接合弹性膜的至少一个突出部分的侧表面的至少一个接合部分。 弹性膜还包括沿挤压方向可膨胀的波纹管部,以使弹性膜按压基板,并沿着挤压方向收缩。

    Substrate holding apparatus and polishing apparatus
    2.
    发明申请
    Substrate holding apparatus and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US20090233532A1

    公开(公告)日:2009-09-17

    申请号:US12453598

    申请日:2009-05-15

    IPC分类号: B24B41/06

    CPC分类号: B24B37/30 B24B37/32 B24B49/16

    摘要: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

    摘要翻译: 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分,其可垂直伸缩。

    Substrate Holding Device And Polishing Apparatus
    3.
    发明申请
    Substrate Holding Device And Polishing Apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US20070293129A1

    公开(公告)日:2007-12-20

    申请号:US11791218

    申请日:2005-12-06

    IPC分类号: B24B37/00 H01L21/304

    CPC分类号: B24B37/30

    摘要: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.

    摘要翻译: 根据本发明的基板保持装置包括与基板的后表面接触的弹性膜,用于固定弹性膜的至少一部分的安装构件和用于保持弹性膜的周边部分的保持环 该基底与弹性膜接触。 弹性膜包括至少一个突出部分,并且附接构件包括接合弹性膜的至少一个突出部分的侧表面的至少一个接合部分。 弹性膜还包括沿挤压方向可膨胀的波纹管部,以使弹性膜按压基板,并沿着挤压方向收缩。

    Substrate holding apparatus and polishing apparatus
    5.
    发明申请
    Substrate holding apparatus and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US20060199479A1

    公开(公告)日:2006-09-07

    申请号:US10543546

    申请日:2004-02-04

    IPC分类号: B24B1/00

    CPC分类号: B24B37/30 B24B37/32 B24B49/16

    摘要: The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber (22). The elastic member (7) comprises a contact portion (8) which is brought into contact with the substrate (W), and a circumferential wall (9) extending upwardly from the contact portion (8) and connected to the vertically movable member (6). The circumferential wall (9) has a stretchable and contractible portion (40) which is stretchable and contractible vertically.

    摘要翻译: 本发明涉及一种用于将基板(W)例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 基板保持装置包括可垂直移动的构件(6)和用于限定腔室(22)的弹性构件(7)。 弹性构件(7)包括与基板(W)接触的接触部分(8)和从接触部分(8)向上延伸并连接到可垂直移动的部件(6)的周壁(9) )。 周壁(9)具有可伸缩的部分(40),其可垂直伸缩。

    Substrate holding apparatus and polishing apparatus
    8.
    发明授权
    Substrate holding apparatus and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US07988537B2

    公开(公告)日:2011-08-02

    申请号:US12073430

    申请日:2008-03-05

    IPC分类号: B24B7/22

    CPC分类号: B24B37/30 B24B37/32 B24B49/16

    摘要: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

    摘要翻译: 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分,其可垂直伸缩。

    Substrate holding apparatus and polishing apparatus
    9.
    发明申请
    Substrate holding apparatus and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US20080166957A1

    公开(公告)日:2008-07-10

    申请号:US12073430

    申请日:2008-03-05

    IPC分类号: B24B7/22

    CPC分类号: B24B37/30 B24B37/32 B24B49/16

    摘要: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

    摘要翻译: 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分,其可垂直伸缩。

    Substrate holding apparatus and polishing apparatus
    10.
    发明授权
    Substrate holding apparatus and polishing apparatus 有权
    基板保持装置和抛光装置

    公开(公告)号:US07108592B2

    公开(公告)日:2006-09-19

    申请号:US10874317

    申请日:2004-06-24

    IPC分类号: B24B29/00 B24B47/02

    CPC分类号: B24B37/30 H01L21/30625

    摘要: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.

    摘要翻译: 本发明涉及一种用于将基板(例如半导体晶片)保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体和用于限定顶环体中的压力室的弹性膜。 将涂层施加到与基底接触的弹性膜的表面上。