公开(公告)号：US10522377B2

公开(公告)日：2019-12-31

申请号：US15200405

申请日：2016-07-01

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Siyuan Tian ,  Eric A. Pape ,  Jorge Jose Zaninovich

IPC: C23C16/00 ,  H01L21/306 ,  H01L21/673 ,  H01L21/67 ,  H01J37/32 ,  H01L23/34 ,  C23C16/505 ,  H01L21/683

Abstract: A temperature controller is provided and includes interfaces, a compensation controller, summers, and a second controller. An interface receives a bias power signal and a plasma signal. The bias power signal indicates a bias RF power level of a RF generator. The plasma signal indicates a plasma RF power level of another RF generator. Another interface receives a temperature signal indicating a temperature of a substrate support. The compensation controller generates a compensation value based on a bias feed-forward transfer function and the bias RF power level and another compensation value based on a plasma feed-forward transfer function and the plasma RF power level. A summer generates an error signal based on a set point and the temperature. The second controller generates a control signal based on the error signal. Another summer controls an actuator to adjust the temperature based on the compensation values and the control signal.

公开(公告)号：US10741429B2

公开(公告)日：2020-08-11

申请号：US16014606

申请日：2018-06-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Tao Zhang ,  Kai Liu ,  Eric Samulon

IPC: H01L21/67 ,  G05B19/418

Abstract: A system for controlling a parameter of a plant associated with a substrate processing chamber is disclosed. A measuring circuit measures a response of the plant associated with the substrate processing chamber when the parameter of the plant is changed. A model generating circuit determines a delay and a gain of the plant based on the response. The model generating circuit generates a model of the plant based on the delay, the gain, and a time constant of the plant. A predicting circuit receives a set point for the parameter and a measurement of the parameter, generates a value of a prediction of the parameter based on the set point for the parameter and the measurement of the parameter using the model, wherein the value of the prediction of the parameter does not include the delay, compares the value of the prediction of the parameter with the set point to generate a control signal, and controls the parameter of the plant based on the control signal.

公开(公告)号：US20190393059A1

公开(公告)日：2019-12-26

申请号：US16014606

申请日：2018-06-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Tao Zhang ,  Kai Liu ,  Eric Samulon

IPC: H01L21/67 ,  G05B19/418

Abstract: A system for controlling a parameter of a plant associated with a substrate processing chamber is disclosed. A measuring module measures a response of the plant associated with the substrate processing chamber when the parameter of the plant is changed. A model generating module determines a delay and a gain of the plant based on the response. The model generating module generates a model of the plant based on the delay, the gain, and a time constant of the plant. A predicting module receives a set point for the parameter and a measurement of the parameter, generates a prediction of a delay-free value of the parameter based on the set point for the parameter and the measurement of the parameter using the model, compares the prediction with the set point to generate a control signal, and controls the parameter of the plant based on the control signal.

公开(公告)号：US09922855B2

公开(公告)日：2018-03-20

申请号：US15692002

申请日：2017-08-31

Applicant: LAM RESEARCH CORPORATION

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  G05D23/19

CPC classification number: H01L21/6831 ,  G05D23/1931 ,  H01L21/67109 ,  H01L21/67248 ,  H01L22/20

Abstract: A method for controlling a substrate temperature in a substrate processing system includes determining a temperature difference between the substrate temperature before the substrate is loaded onto a substrate support device and a desired temperature for the substrate support device and, during a first period, controlling a thermal control element to adjust the temperature of the substrate support device to a temperature value based on the temperature difference. The temperature value is not equal to the desired temperature for the substrate support device. The method further includes loading the substrate onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature and, during a second period that follows the first period, controlling the temperature of the substrate support device to the desired temperature for the substrate support device.

公开(公告)号：US10509425B2

公开(公告)日：2019-12-17

申请号：US15411389

申请日：2017-01-20

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Jorge Jose Zaninovich ,  Fred Egley

IPC: G05D23/19 ,  H01L21/67

Abstract: A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.

公开(公告)号：US10096506B2

公开(公告)日：2018-10-09

申请号：US15897669

申请日：2018-02-15

Applicant: LAM RESEARCH CORPORATION

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/00 ,  H01L21/683 ,  G05D23/19 ,  H01L21/67 ,  H01L21/66

Abstract: A temperature controller for a substrate processing system includes an interface configured to receive a processing temperature corresponding to a desired processing temperature of a substrate. The temperature controller includes a thermal control element controller configured to selectively control a thermal control element to adjust a temperature of a substrate support. The thermal control element controller is further configured to, prior to the substrate being loaded onto the substrate support, determine at least one of a temperature of the substrate support and a temperature of the substrate and, based on the processing temperature and the at least one of the temperature of the substrate support and the temperature of the substrate, control the thermal control element to adjust the temperature of the substrate support to a setpoint temperature that is different than the processing temperature.

公开(公告)号：US20180005857A1

公开(公告)日：2018-01-04

申请号：US15200405

申请日：2016-07-01

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Siyuan Tian ,  Eric A. Pape ,  Jorge Jose Zaninovich

IPC: H01L21/673 ,  H01J37/32 ,  C23C16/505 ,  H01L21/683

Abstract: A temperature controller is provided and includes interfaces, a compensation controller, summers, and a second controller. An interface receives a bias power signal and a plasma signal. The bias power signal indicates a bias RF power level of a RF generator. The plasma signal indicates a plasma RF power level of another RF generator. Another interface receives a temperature signal indicating a temperature of a substrate support. The compensation controller generates a compensation value based on a bias feed-forward transfer function and the bias RF power level and another compensation value based on a plasma feed-forward transfer function and the plasma RF power level. A summer generates an error signal based on a set point and the temperature. The second controller generates a control signal based on the error signal. Another summer controls an actuator to adjust the temperature based on the compensation values and the control signal.

公开(公告)号：US20160372355A1

公开(公告)日：2016-12-22

申请号：US14860045

申请日：2015-09-21

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  G01K3/08

CPC classification number: H01L21/6831 ,  G05D23/1931 ,  H01L21/67109 ,  H01L21/67248 ,  H01L22/20

Abstract: A system for controlling a substrate temperature in a substrate processing system includes a substrate support device, a controller, a temperature sensor, and a thermal control element (TCE). The controller is configured to, during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device. The temperature value is not equal to the desired temperature. The substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature. The controller is further configured to, during a second period following the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.

Abstract translation: 用于控制基板处理系统中的基板温度的系统包括基板支撑装置，控制器，温度传感器和热控制元件（TCE）。 控制器被配置为在第一时段期间控制TCE以基于衬底被加载到衬底支撑装置之前的衬底温度和所需温度之间的温度差来调节衬底支撑装置的温度到温度值 用于基板支撑装置。 温度值不等于所需温度。 在第一周期开始之后并且在基板支撑装置的温度恢复到所需温度之前，将基板装载到基板支撑装置上。 控制器还被配置为在第一时段之后的第二时段期间，将衬底支撑装置的温度控制到衬底支撑装置的期望温度。

公开(公告)号：US20180210473A1

公开(公告)日：2018-07-26

申请号：US15411389

申请日：2017-01-20

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Jorge Jose Zaninovich ,  Fred Egley

IPC: G05D23/19 ,  G05B17/02

Abstract: A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.

公开(公告)号：US09779974B2

公开(公告)日：2017-10-03

申请号：US14860045

申请日：2015-09-21

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  G01K3/08 ,  G05D23/19

CPC classification number: H01L21/6831 ,  G05D23/1931 ,  H01L21/67109 ,  H01L21/67248 ,  H01L22/20

Abstract: A system for controlling a substrate temperature in a substrate processing system includes a substrate support device, a controller, a temperature sensor, and a thermal control element (TCE). The controller is configured to, during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device. The temperature value is not equal to the desired temperature. The substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature. The controller is further configured to, during a second period following the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.