公开(公告)号：US20250072188A1

公开(公告)日：2025-02-27

申请号：US18727604

申请日：2022-01-19

Applicant: LG ELECTRONICS INC.

Inventor： Jinhyeok CHOI ,  Indo CHUNG ,  Youngdo KIM

IPC: H01L33/62 ,  H01L25/075

Abstract: A display device can include a substrate, a first assembling wiring on the substrate, a second assembling wiring on the substrate, a partition wall disposed on the first and second assembling wirings and having a hole, a semiconductor light-emitting device disposed in the hole and having a first step difference part on a side portion thereof, and a connection electrode disposed on at least the first step difference part.

公开(公告)号：US20190181124A1

公开(公告)日：2019-06-13

申请号：US16213397

申请日：2018-12-07

Applicant: LG Electronics Inc.

Inventor： Jinhyeok CHOI ,  Heonsuk OH ,  Yeonji LEE

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  H01L23/538

Abstract: The present invention provides a display device, including a display unit having a plurality of semiconductor light emitting devices and outputting light to an upper surface thereof, a transparent substrate located on an upper side of the display unit and having a fixing portion protruding from one surface thereof to surround a side surface of the display unit, an elastic portion located to cover a lower surface of the display unit and made of an elastic member, a first back cover coupled to a part of the transparent substrate not overlapping the display unit in an injection manner, and a second back cover located to overlap the display unit and fixed to the first back cover, wherein the elastic portion presses the display unit toward the transparent substrate.

公开(公告)号：US20230304111A1

公开(公告)日：2023-09-28

申请号：US18011915

申请日：2020-06-23

Applicant: LG ELECTRONICS INC.

Inventor： Hyunkwon SHIN ,  Namseok KANG ,  Jinmok OH ,  Jinhyeok CHOI

IPC: C21D6/00 ,  C22C9/00 ,  C22C38/04 ,  C22C38/06 ,  C22C38/16 ,  C22F1/08 ,  C23C8/24

CPC classification number: C21D6/005 ,  C22C9/00 ,  C22C38/04 ,  C22C38/06 ,  C22C38/16 ,  C22F1/08 ,  C23C8/24

Abstract: A high-entropy alloy, according to the present embodiment, comprises a first phase and a second phase respectively comprising iron and copper, and iron and a first metal other than copper, and having mutually different compositions. A reinforcement compound formed by the chemical bonding of the first metal and a non-metal can be selectively included in the first phase.