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公开(公告)号：US20240426530A1
公开(公告)日：2024-12-26
申请号：US18748380
申请日：2024-06-20
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat pump may include a compressor configured to compress a refrigerant; an accumulator configured to supply the refrigerant to the compressor; a receiver connected to the accumulator; a fluid-refrigerant heat exchanger configured to exchange heat between a fluid, such as water, and the refrigerant; an outdoor heat exchanger configured to exchange heat between outdoor air and the refrigerant; a 4-way valve configured to guide the refrigerant, discharged from the compressor, to flow into the fluid-refrigerant heat exchanger or the outdoor heat exchanger; at least one expansion valve disposed between the fluid-refrigerant heat exchanger and the outdoor heat exchanger; a first valve disposed between the fluid-refrigerant heat exchanger and the receiver; a second valve disposed between the compressor and the receiver; and a third valve disposed between the receiver and the accumulator.
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公开(公告)号：US20250027695A1
公开(公告)日：2025-01-23
申请号：US18775618
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger connected to the compressor and exchanging heat between refrigerant and water; a second heat exchanger connected to the compressor and exchanging heat between refrigerant and air; and a gas-liquid separator separating refrigerant into gaseous refrigerant and liquid refrigerant, the gas-liquid separator including: a housing; and a penetration pipe passing through sides of the housing and including an inlet flow path through which mixed refrigerant flows in and an outlet flow path through which gaseous refrigerant flows out, and the penetration pipe including: a first connecting hole formed on a surface and connecting the inlet flow path and the inside of the housing; a second connecting hole formed on a surface and connecting the outlet flow path and the inside of the housing; and a separation plate partitioning the inlet flow path and the outlet flow path.
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Patent Agency Ranking
公开(公告)号：US20140326013A1
公开(公告)日：2014-11-06
申请号：US14334925
申请日：2014-07-18
Applicant: LG ELECTRONICS INC.
Inventor： Byungsoon KIM , Jahyung KOO , Kyongmin KWON
CPC classification number: F24H9/0005 , F24D11/0214 , F24D17/02 , F24D19/1072 , F25B13/00 , F25B25/005 , F25B30/02 , F25B2339/047 , Y02B30/125
Abstract: A hot water supply apparatus associated with a heat pump is provided. The hot water supply apparatus may employ a cascade heat pump including a two-stage cycle to perform a hot water supply operation. Refrigerants flowing through a heat side heat exchanger and a usage side heat exchanger may be heat-exchanged with water. Thus, the hot water supply operation may be continuously performed, without a defrosting operation, and hot water supply performance and heating performance may be improved.
Abstract translation: 提供与热泵相关联的热水供应装置。 热水供给装置可以采用包括两级循环的级联热泵来执行热水供给操作。 流过热侧热交换器和使用侧热交换器的制冷剂可以与水进行热交换。 因此，可以在不进行除霜运转的情况下连续进行热水供给动作，能够提高热水供给性能和加热性能。
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公开(公告)号：US20250027691A1
公开(公告)日：2025-01-23
申请号：US18775444
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and outdoor air, wherein the second heat exchanger includes a plurality of pipes through which refrigerant flows; and a valve adjusting the flow of refrigerant through the lowermost pipe of the plurality of pipes, and the valve allows refrigerant to flow only in a first direction that sequentially passes the compressor, the second heat exchanger, and the indoor heat exchanger.
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公开(公告)号：US20140326012A1
公开(公告)日：2014-11-06
申请号：US14334880
申请日：2014-07-18
Applicant: LG ELECTRONICS INC.
Inventor： Byungsoon KIM , Jahyung KOO , Kyongmin KWON
CPC classification number: F24H9/0005 , F24D11/0214 , F24D17/02 , F24D19/1072 , F25B13/00 , F25B25/005 , F25B30/02 , F25B2339/047 , Y02B30/125
Abstract: A hot water supply apparatus associated with a heat pump is provided. The hot water supply apparatus may employ a cascade heat pump including a two-stage cycle to perform a hot water supply operation. Refrigerants flowing through a heat side heat exchanger and a usage side heat exchanger may be heat-exchanged with water. Thus, the hot water supply operation may be continuously performed, without a defrosting operation, and hot water supply performance and heating performance may be improved.
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公开(公告)号：US20250027678A1
公开(公告)日：2025-01-23
申请号：US18775859
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
IPC: F24H4/02 , F25B41/325
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and air; a first expansion device disposed in a refrigerant pipe connecting the first heat exchanger and the second heat exchanger; a second expansion device connected to the first expansion device in parallel and opened and closed according to an electrical signal; and a controller controlling the degree of opening of the second expansion device, wherein, if heating operation is started, and temperature of water flowing into the first heat exchanger is higher than temperature of refrigerant flowing into the first heat exchanger, the controller opens the second expansion device.
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公开(公告)号：US20250027677A1
公开(公告)日：2025-01-23
申请号：US18775751
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and having a plurality of pipes exchanging heat between refrigerant and air, wherein the plurality of pipes include: a first pipe disposed in the lowermost part; and the second pipes disposed above the first pipe, wherein the first pipe directs refrigerant flow in the opposite direction to the refrigerant flow in the remaining pipes.
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