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公开(公告)号：US20240426530A1
公开(公告)日：2024-12-26
申请号：US18748380
申请日：2024-06-20
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat pump may include a compressor configured to compress a refrigerant; an accumulator configured to supply the refrigerant to the compressor; a receiver connected to the accumulator; a fluid-refrigerant heat exchanger configured to exchange heat between a fluid, such as water, and the refrigerant; an outdoor heat exchanger configured to exchange heat between outdoor air and the refrigerant; a 4-way valve configured to guide the refrigerant, discharged from the compressor, to flow into the fluid-refrigerant heat exchanger or the outdoor heat exchanger; at least one expansion valve disposed between the fluid-refrigerant heat exchanger and the outdoor heat exchanger; a first valve disposed between the fluid-refrigerant heat exchanger and the receiver; a second valve disposed between the compressor and the receiver; and a third valve disposed between the receiver and the accumulator.
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公开(公告)号：US20250027691A1
公开(公告)日：2025-01-23
申请号：US18775444
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and outdoor air, wherein the second heat exchanger includes a plurality of pipes through which refrigerant flows; and a valve adjusting the flow of refrigerant through the lowermost pipe of the plurality of pipes, and the valve allows refrigerant to flow only in a first direction that sequentially passes the compressor, the second heat exchanger, and the indoor heat exchanger.
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公开(公告)号：US20250027695A1
公开(公告)日：2025-01-23
申请号：US18775618
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger connected to the compressor and exchanging heat between refrigerant and water; a second heat exchanger connected to the compressor and exchanging heat between refrigerant and air; and a gas-liquid separator separating refrigerant into gaseous refrigerant and liquid refrigerant, the gas-liquid separator including: a housing; and a penetration pipe passing through sides of the housing and including an inlet flow path through which mixed refrigerant flows in and an outlet flow path through which gaseous refrigerant flows out, and the penetration pipe including: a first connecting hole formed on a surface and connecting the inlet flow path and the inside of the housing; a second connecting hole formed on a surface and connecting the outlet flow path and the inside of the housing; and a separation plate partitioning the inlet flow path and the outlet flow path.
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Patent Agency Ranking
公开(公告)号：US20240151431A1
公开(公告)日：2024-05-09
申请号：US18280538
申请日：2022-03-07
Applicant: LG ELECTRONICS INC.
Inventor： Bonggil JEON , Doyong HA , Jeongseob SHIN , Heewoong PARK
Abstract: The present invention relates to a hot water supply tank. A hot water supply tank, according to an embodiment of the present invention, comprises: a storage part which accommodates a fluid therein; an internal water outlet pipe through which a fluid flows from the storage part toward a heat pump; an internal water supply pipe through which the fluid flows from the heat pump toward the storage part; and an internal pipe which is disposed inside the storage part, wherein the internal pipe includes: a connection pipe which is connected to the internal water supply pipe, and at least a part of which is flexible; and a discharge pipe which has one end connected to the connection pipe and extending long, wherein a pipe through hole passing through the discharge pipe may be formed at the other end of the discharge pipe. Various other embodiments are possible.
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公开(公告)号：US20240353157A1
公开(公告)日：2024-10-24
申请号：US18721610
申请日：2022-11-02
Applicant: LG ELECTRONICS INC.
Inventor： Sangil PARK , Jeongseob SHIN , Seungtaek OH , Soojin KANG
CPC classification number: F25B30/02 , F25B41/20 , F25B2400/051 , F25B2600/2501 , F25B2600/2513 , F25B2700/21152
Abstract: A heat pump may include: a compressor compressing refrigerant received from an accumulator; a water-refrigerant heat exchanger exchanging heat between the refrigerant discharged from the compressor and water; a main expansion valve expanding the refrigerant passed through the water-refrigerant heat exchanger; an outdoor heat exchanger exchanging heat between the refrigerant passed through the main expansion valve and outdoor air and connected to the accumulator; a main pipe connecting the water-refrigerant heat exchanger and the outdoor heat exchanger, the main pipe at which the main expansion valve is installed; an internal heat exchanger installed at the main pipe between the water-refrigerant heat exchanger and the main expansion valve; an injection pipe at which the internal heat exchanger is installed; an injection valve installed at the injection pipe; a bypass pipe; and a bypass valve installed at the bypass pipe.
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公开(公告)号：US20220090822A1
公开(公告)日：2022-03-24
申请号：US17424971
申请日：2020-01-22
Applicant: LG ELECTRONICS INC.
Inventor： Heewoong PARK , Jeongseob SHIN
Abstract: Provided is a hot water supply tank including: a case forming an appearance of the hot water supply tank; a heating container accommodating a fluid and having an inner side treated with anticorrosive; a heater installed on an outer side of the heating container and transferring heat to the fluid; and a heat insulator interposed between the case and the heater, wherein in a predetermined volume of the heating container, a ratio at which a performance of the heater to transfer heat (hereinafter, heat transfer performance) is maximized (hereinafter, optimum ratio) among the ratios of side height to bottom diameter of the heating container (hereinafter, aspect ratios) is determined by whether the heater is installed on the bottom as well as side of the heating container, and determined based on an area of the heating container occupied by the heater (hereinafter, heat transfer area).
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公开(公告)号：US20250027678A1
公开(公告)日：2025-01-23
申请号：US18775859
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
IPC: F24H4/02 , F25B41/325
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and air; a first expansion device disposed in a refrigerant pipe connecting the first heat exchanger and the second heat exchanger; a second expansion device connected to the first expansion device in parallel and opened and closed according to an electrical signal; and a controller controlling the degree of opening of the second expansion device, wherein, if heating operation is started, and temperature of water flowing into the first heat exchanger is higher than temperature of refrigerant flowing into the first heat exchanger, the controller opens the second expansion device.
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公开(公告)号：US20250027677A1
公开(公告)日：2025-01-23
申请号：US18775751
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and having a plurality of pipes exchanging heat between refrigerant and air, wherein the plurality of pipes include: a first pipe disposed in the lowermost part; and the second pipes disposed above the first pipe, wherein the first pipe directs refrigerant flow in the opposite direction to the refrigerant flow in the remaining pipes.
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