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公开(公告)号：US20240426530A1
公开(公告)日：2024-12-26
申请号：US18748380
申请日：2024-06-20
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat pump may include a compressor configured to compress a refrigerant; an accumulator configured to supply the refrigerant to the compressor; a receiver connected to the accumulator; a fluid-refrigerant heat exchanger configured to exchange heat between a fluid, such as water, and the refrigerant; an outdoor heat exchanger configured to exchange heat between outdoor air and the refrigerant; a 4-way valve configured to guide the refrigerant, discharged from the compressor, to flow into the fluid-refrigerant heat exchanger or the outdoor heat exchanger; at least one expansion valve disposed between the fluid-refrigerant heat exchanger and the outdoor heat exchanger; a first valve disposed between the fluid-refrigerant heat exchanger and the receiver; a second valve disposed between the compressor and the receiver; and a third valve disposed between the receiver and the accumulator.
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公开(公告)号：US20250035348A1
公开(公告)日：2025-01-30
申请号：US18769551
申请日：2024-07-11
Applicant: LG ELECTRONICS INC.
Inventor： Seungtaek OH , Hyunjong KIM , Kyoungmin KWON
Abstract: The present disclosure relates to a heat supplier. The heat supplier includes: a compressor to compress a refrigerant; a first heat exchanger to exchange heat between air and the refrigerant; a second heat exchanger to exchange heat between water and the refrigerant; a switching valve to direct the refrigerant discharged from the compressor into the first heat exchanger or the second heat exchanger; a third heat exchanger to exchange heat between refrigerant flowing through a liquid pipe, which connects the first heat exchanger and the second heat exchanger, and refrigerant branched from the liquid pipe and expanded; a first expansion valve to expand refrigerant flowing from the third heat exchanger to the first heat exchanger; and a second expansion valve to expand refrigerant flowing from the third heat exchanger to the second heat exchanger. The first expansion valve and the second expansion valve are selectively opened and closed according to a direction of the refrigerant flowing through the third heat exchanger, allowing the refrigerant that has passed through the third heat exchanger to flow into the first expansion valve or the second expansion valve.
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Patent Agency Ranking
公开(公告)号：US20250027691A1
公开(公告)日：2025-01-23
申请号：US18775444
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and outdoor air, wherein the second heat exchanger includes a plurality of pipes through which refrigerant flows; and a valve adjusting the flow of refrigerant through the lowermost pipe of the plurality of pipes, and the valve allows refrigerant to flow only in a first direction that sequentially passes the compressor, the second heat exchanger, and the indoor heat exchanger.
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公开(公告)号：US20240353157A1
公开(公告)日：2024-10-24
申请号：US18721610
申请日：2022-11-02
Applicant: LG ELECTRONICS INC.
Inventor： Sangil PARK , Jeongseob SHIN , Seungtaek OH , Soojin KANG
CPC classification number: F25B30/02 , F25B41/20 , F25B2400/051 , F25B2600/2501 , F25B2600/2513 , F25B2700/21152
Abstract: A heat pump may include: a compressor compressing refrigerant received from an accumulator; a water-refrigerant heat exchanger exchanging heat between the refrigerant discharged from the compressor and water; a main expansion valve expanding the refrigerant passed through the water-refrigerant heat exchanger; an outdoor heat exchanger exchanging heat between the refrigerant passed through the main expansion valve and outdoor air and connected to the accumulator; a main pipe connecting the water-refrigerant heat exchanger and the outdoor heat exchanger, the main pipe at which the main expansion valve is installed; an internal heat exchanger installed at the main pipe between the water-refrigerant heat exchanger and the main expansion valve; an injection pipe at which the internal heat exchanger is installed; an injection valve installed at the injection pipe; a bypass pipe; and a bypass valve installed at the bypass pipe.
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公开(公告)号：US20250035351A1
公开(公告)日：2025-01-30
申请号：US18779238
申请日：2024-07-22
Applicant: LG ELECTRONICS INC.
Inventor： Seungtaek OH , Doyong Ha , Jeongseob Shin , Sangil Park , Soojin Kang , Hyunjong Kim , Kyongmin Kwon
Abstract: A heat supplier may include a compressor that compresses a refrigerant; a first heat exchanger that exchanges heat between air and the refrigerant; a second heat exchanger that exchanges heat between a fluid and the refrigerant; a switching valve that directs the refrigerant discharged from the compressor into the first heat exchanger or the second heat exchanger; a first liquid pipe that connects the first heat exchanger and the second heat exchanger; a second liquid pipe connected in parallel to the first liquid pipe so as to connect the first heat exchanger and the second heat exchanger; a first expansion valve disposed at the first liquid pipe and configured to expand refrigerant flowing therethrough; and a second expansion valve disposed at the second liquid pipe and configured to expand refrigerant flowing therethrough. A size of an aperture of the second expansion valve may be greater than a size of an aperture of the first expansion valve, enabling a flow rate of refrigerant to be adjusted according to an operation mode.
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公开(公告)号：US20250027678A1
公开(公告)日：2025-01-23
申请号：US18775859
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
IPC: F24H4/02 , F25B41/325
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and air; a first expansion device disposed in a refrigerant pipe connecting the first heat exchanger and the second heat exchanger; a second expansion device connected to the first expansion device in parallel and opened and closed according to an electrical signal; and a controller controlling the degree of opening of the second expansion device, wherein, if heating operation is started, and temperature of water flowing into the first heat exchanger is higher than temperature of refrigerant flowing into the first heat exchanger, the controller opens the second expansion device.
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公开(公告)号：US20250027677A1
公开(公告)日：2025-01-23
申请号：US18775751
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and having a plurality of pipes exchanging heat between refrigerant and air, wherein the plurality of pipes include: a first pipe disposed in the lowermost part; and the second pipes disposed above the first pipe, wherein the first pipe directs refrigerant flow in the opposite direction to the refrigerant flow in the remaining pipes.
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