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    Planar lighting device
    1.
    发明授权
    Planar lighting device 有权

    公开(公告)号：US10185178B2

    公开(公告)日：2019-01-22

    申请号：US15351136

    申请日：2016-11-14

    Applicant: LG ELECTRONICS INC.

    Inventor： Yongjin Kim ,  Munheon Hong ,  Chilkeun Park ,  Sangcheon Kim ,  Mangeun Kim

    IPC: F21V1/00 ,  G02F1/1335 ,  F21V11/16 ,  F21V7/00 ,  F21Y105/00 ,  G02F1/1333 ,  F21V8/00

    Abstract: A lighting device including a circuit substrate; a plurality of light sources disposed on the circuit substrate; a reflection layer disposed on the circuit substrate, the reflection layer comprising a plurality of openings where respective light sources are located; a plurality of absorbers disposed at an edge of the reflection layer and at an angle with respect to the reflection layer, wherein first areas aligned with the respective light sources have a greater density of the plurality of absorbers than second areas between the first areas; and an optical sheet disposed on the light sources. In addition, a central axis of a corresponding first area matches a central axis of a corresponding light source.

    NON-CONTACT TYPE INFRARED TEMPERATURE SENSOR MODULE
    3.
    发明申请
    NON-CONTACT TYPE INFRARED TEMPERATURE SENSOR MODULE 审中-公开

    公开(公告)号：US20200232853A1

    公开(公告)日：2020-07-23

    申请号：US16305747

    申请日：2016-08-24

    Applicant: LG ELECTRONICS INC.

    Inventor： Hyojin Nam ,  Kyoungwoo Jo ,  Mangeun Kim ,  Seungwoo Ham

    IPC: G01J5/20 ,  G01J5/08

    Abstract: A non-contact type infrared temperature sensor module according to an embodiment of the present invention can comprise: a case of which a portion of an upper surface is opened and having an accommodation space formed therein; a base having an upper surface coupled to the case; a cover window provided on the upper surface of the case and sealing the opened portion of the case; an infrared temperature sensor provided on the upper surface of the base and sensing the temperature of an object by receiving light transmitted from the cover window; and a first capping unit coupled to an upper portion of the infrared temperature sensor and blocking heat transmitted from the accommodation space.

    Planar lighting device
    6.
    发明授权
    Planar lighting device 有权

    公开(公告)号：US10962833B2

    公开(公告)日：2021-03-30

    申请号：US16806480

    申请日：2020-03-02

    Applicant: LG ELECTRONICS INC.

    Inventor： Yongjin Kim ,  Munheon Hong ,  Chilkeun Park ,  Sangcheon Kim ,  Mangeun Kim

    IPC: G02F1/13357 ,  F21V11/16 ,  F21V7/00 ,  G02F1/1333 ,  F21V8/00 ,  F21Y105/00

    Abstract: A display device includes a lower cover; a circuit substrate disposed on the lower cover; a plurality of light sources disposed on the circuit substrate; a reflection layer disposed on the circuit substrate; a light regulator disposed at an edge of the reflection layer at an angle with respect to the reflection layer; and an optical sheet disposed on the plurality of light sources. Further, the light regulator includes a reflector portion reflecting light from the plurality of light sources; and an absorber portion having holes arranged in a pattern. In addition, light emitted from a respective light source close to the edge passes through the holes.

    Light emitting device package assembly and method of fabricating the same
    10.
    发明授权
    Light emitting device package assembly and method of fabricating the same 有权

    公开(公告)号：US10211186B2

    公开(公告)日：2019-02-19

    申请号：US15217629

    申请日：2016-07-22

    Applicant: LG ELECTRONICS INC.

    Inventor： Seongman Jeon ,  Moongoo Choi ,  Mangeun Kim ,  Jinwoo Sung

    IPC: H01L25/075 ,  H01L33/50

    Abstract: A light emitting device package assembly including a first substrate, a plurality of light emitting device packages disposed on the first substrate, and a light conversion member disposed on the light emitting device packages. Each of the light emitting device packages includes a main body disposed on the first substrate and including a first cavity, a light source disposed in the first cavity, and a first matrix disposed in the first cavity. Further, the light conversion member includes a second substrate including a plurality of second cavities, a second matrix disposed in the second cavities, and first light conversion particles disposed in the second matrix.

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