公开(公告)号：US20250072185A1

公开(公告)日：2025-02-27

申请号：US18723703

申请日：2022-07-08

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Sunho KIM ,  Youngwook LEE ,  Gisang HONG ,  Jongwon LEE

IPC: H01L33/62 ,  H01L25/16 ,  H01L27/12

Abstract: A display device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring that are spaced apart from each other on the substrate and each include a conductive layer and a clad layer on the conductive layer, a structure that is in contact with the second assembly wiring and has a reverse taper shape, a planarization layer that is disposed on the first assembly wiring and the second assembly wiring and has an opening, and a light emitting device that is disposed inside the opening and has a first electrode overlapping the first assembly wiring and the second assembly wiring, wherein the structure is disposed to cover a portion of an upper surface of the conductive layer of the second assembly wiring.

公开(公告)号：US20150190992A1

公开(公告)日：2015-07-09

申请号：US14663076

申请日：2015-03-19

Applicant: LG Electronics Inc.

Inventor： Jongwon LEE ,  Kyungho JUNG ,  Deokhai PARK ,  Eunseck KANG

IPC: B32B37/02 ,  B32B38/00 ,  B32B38/18 ,  B32B37/06

CPC classification number: B32B37/02 ,  B29C70/202 ,  B29C70/34 ,  B29K2995/0026 ,  B32B5/12 ,  B32B5/26 ,  B32B17/04 ,  B32B37/06 ,  B32B38/004 ,  B32B38/1816 ,  B32B2262/101 ,  B32B2305/08 ,  B32B2305/10 ,  B32B2307/412 ,  B32B2309/02 ,  B32B2383/00 ,  B32B2551/00 ,  Y10T428/24058 ,  Y10T428/24124 ,  Y10T428/249921

Abstract: A method for manufacturing a transparent composite material including preparing a film coated with a transparent resin, unidirectionally aligning glass fiber filaments and manufacturing a glass fiber plate by embedding the unidirectionally aligned glass fiber filaments in the transparent resin, wherein the transparent resin includes Si—O—Si bond and one of methyl, ethyl and phenyl.

Abstract translation: 一种制造透明复合材料的方法，包括制备涂有透明树脂的薄膜，通过将单向排列的玻璃纤维丝包埋在透明树脂中来单向对准玻璃纤维丝并制造玻璃纤维板，其中透明树脂包括Si-O -Si键和甲基，乙基和苯基之一。