公开(公告)号：US10731913B2

公开(公告)日：2020-08-04

申请号：US15862322

申请日：2018-01-04

Applicant: LG Electronics Inc.

Inventor： Yoo Min Park ,  Myeongha Yi ,  Jinho Son

IPC: F25D17/06 ,  F25B21/02 ,  F25D23/08 ,  F25D11/02 ,  F25D25/02 ,  F25D23/06 ,  F25B5/02

Abstract: A refrigerator that includes: a storage space configured to be cooled by a refrigeration cycle cooling system; a wall defines a boundary of the storage space; a low temperature case that is arranged adjacent to a portion of a first surface of the wall; a thermoelectric element module (TEM) assembly that is configured to supply cool air to the low temperature case; and a TEM accommodating part that protrudes from the first surface of the wall and that accommodates the TEM assembly, wherein the low temperature case includes an opening through which the TEM accommodating part is inserted, and wherein a sealant is provided between the low temperature case and the wall to couple the low temperature case to the first surface of the wall is disclosed.

公开(公告)号：US11313606B2

公开(公告)日：2022-04-26

申请号：US16927669

申请日：2020-07-13

Applicant: LG Electronics Inc.

Inventor： Yoo Min Park ,  Myeongha Yi ,  Jinho Son

IPC: F25D17/06 ,  F25D11/02 ,  F25D23/06 ,  F25B21/02 ,  F25D23/08 ,  F25D25/02 ,  F25B5/02

Abstract: A refrigerator that includes: a storage space configured to be cooled by a refrigeration cycle cooling system; a wall defines a boundary of the storage space; a low temperature case that is arranged adjacent to a portion of a first surface of the wall; a thermoelectric element module (TEM) assembly that is configured to supply cool air to the low temperature case; and a TEM accommodating part that protrudes from the first surface of the wall and that accommodates the TEM assembly, wherein the low temperature case includes an opening through which the TEM accommodating part is inserted, and wherein a sealant is provided between the low temperature case and the wall to couple the low temperature case to the first surface of the wall is disclosed.

公开(公告)号：US09897920B2

公开(公告)日：2018-02-20

申请号：US14645009

申请日：2015-03-11

Applicant: LG ELECTRONICS INC. ,  AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Yunhee Ku ,  Moosub Kim ,  Yongju Yang ,  Seung Yeon Song ,  Kang Sun Lee ,  Hyun Chul Yoon ,  Yong Duk Han ,  Yoo Min Park

IPC: C12Q1/54 ,  C12Q1/28 ,  C12Q1/00 ,  G03F7/20 ,  G01N21/78 ,  G03F7/027

CPC classification number: G03F7/2002 ,  G01N21/78 ,  G01N2400/00 ,  G03F7/027

Abstract: The present disclosure relates to a sensor for detecting saccharide and manufacturing method thereof and detection method of glycated hemoglobin using the same wherein the sensor for detecting saccharide includes a reactive layer synthesized with hydrogel having a boronic acid-modified 3D mesh structure. A selective and sensitive detection of the glycated protein including glucose or glycated hemoglobin (HbA1c) in blood through high level of signal may be enabled, and the durability of the sensor for detecting saccharide may be enhanced.