公开(公告)号：US20200027754A1

公开(公告)日：2020-01-23

申请号：US16488058

申请日：2018-02-27

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yusuke NEZU ,  Takashi SUGINO

IPC: H01L21/56 ,  C09J7/38 ,  C09J11/04 ,  B32B7/12 ,  B32B37/12

Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.

公开(公告)号：US20200006167A1

公开(公告)日：2020-01-02

申请号：US16488531

申请日：2018-02-05

Applicant: LINTEC CORPORATION

Inventor： Yusuke NEZU ,  Takashi SUGINO

IPC: H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  C08K3/36 ,  H01L33/56

Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method for producing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of 550 m2/g or more and 1,500 m2/g or less. The sealing sheet is less likely to cause the inorganic filler to escape from a cured layer 11′.