公开(公告)号：US20170349790A1

公开(公告)日：2017-12-07

申请号：US15541131

申请日：2015-07-17

申请人： LINTEC Corporation

发明人： Masaya TODAKA ,  Baku KATAGIRI ,  Kenta TOMIOKA ,  Tomoo ORUI

IPC分类号： C09J7/02 ,  G06F3/044

CPC分类号： G06F3/044 ,  C09J7/22 ,  C09J7/38 ,  C09J201/00 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2451/00 ,  G06F2203/04103

摘要： Provided are a surface protection film which would stably display an image, and would stably attain a mirror state, and which would be stably operated without inhibiting display operability.Disclosed is a surface protection film including a resin film and a pressure-sensitive adhesive layer, in which the relative permittivity of the resin film is of 1.0 to 5.0, the reflectance is set to a value within the range of 20% to 80%, and the transmittance for light is of 20% to 80%.

公开(公告)号：US20180292308A1

公开(公告)日：2018-10-11

申请号：US15924394

申请日：2018-03-19

申请人： LINTEC CORPORATION

发明人： Hiroki HOSHINO ,  Masaya TODAKA ,  Tomoo ORUI

IPC分类号： G01N21/03 ,  B32B3/30 ,  B32B7/14 ,  B32B7/04

摘要： A cover film for testing which can be well fixed to a substrate having a groove and with which a material that constitutes an adhesive layer does not invade into the groove and a specimen can be easily stored in the groove, providing a testing member including the cover film for testing, and providing a method of manufacturing the cover film for testing.The cover film for testing comprises a base material, a hydrophilic coating layer laminated on a surface of the base material, and an adhesive layer partially laminated on a surface of the hydrophilic coating layer opposite to the base material, whereby the cover film for testing has a region in which the adhesive layer is absent and the hydrophilic coating layer is exposed.

公开(公告)号：US20180178485A1

公开(公告)日：2018-06-28

申请号：US15832914

申请日：2017-12-06

申请人： LINTEC CORPORATION

发明人： Hiroki HOSHINO ,  Masaya TODAKA ,  Tomoo ORUI

IPC分类号： B32B3/30 ,  B32B27/06 ,  B32B37/06 ,  G01N21/03

CPC分类号： B32B3/30 ,  B32B27/06 ,  B32B37/06 ,  B32B2307/412 ,  B32B2309/105 ,  G01N21/03 ,  G01N21/51 ,  G01N2021/0357 ,  G01N2021/0378 ,  G01N2021/6482

摘要： [Problems] Objects include providing a cover film for testing that can be well fixed to a substrate having a groove and does not adversely affect the groove, providing a testing member comprising the cover film for testing, and providing a method of manufacturing the testing member.[Solution] The cover film for testing (1) comprises a base material (10) and a thermoplastic resin layer (20) laminated on one surface side of the base material (10). The thermoplastic resin layer (20) constitutes an outermost layer at one side of the cover film for testing (1).

公开(公告)号：US20210376218A1

公开(公告)日：2021-12-02

申请号：US17271091

申请日：2019-08-27

申请人： LINTEC CORPORATION

发明人： Masaya TODAKA ,  Kunihisa KATO ,  Tsuyoshi MUTO ,  Yuma KATSUTA

IPC分类号： H01L35/34 ,  H01L35/08 ,  H01L35/16

摘要： Provided are: a method for producing a chip of a thermoelectric conversion material that enables annealing treatment of a thermoelectric conversion material in the form not having a junction with an electrode, and enables annealing of a thermoelectric semiconductor material at an optimum annealing temperature; and a method for producing a thermoelectric conversion module using the chip (13). Also provided are: a method for producing a chip of a thermoelectric conversion material formed of a thermoelectric semiconductor composition, including (A) a step of forming a sacrificial layer (2) on a substrate (1), (B) a step of forming a chip of a thermoelectric conversion material on the sacrificial layer formed in the step (A), (C) a step of annealing the chip of a thermoelectric conversion material formed in the step (B), and (D) a step of peeling the chip of a thermoelectric conversion material annealed in the step (C); and a method for producing a thermoelectric conversion module using the chip produced according to the production method.

公开(公告)号：US20210257531A1

公开(公告)日：2021-08-19

申请号：US17271021

申请日：2019-08-27

申请人： LINTEC CORPORATION

发明人： Kunihisa KATO ,  Tsuyoshi MUTO ,  Masaya TODAKA ,  Yuma KATSUTA

IPC分类号： H01L35/34 ,  H01L35/08 ,  H01L35/32

摘要： A method for producing a chip of a thermoelectric conversion material formed of a thermoelectric semiconductor composition, including a step of forming a sacrificial layer on a substrate, (B) a step of forming a thermoelectric conversion material layer of a thermoelectric semiconductor composition on the sacrificial layer, (C) a step of annealing the thermoelectric conversion material layer, (D) a step of transferring the annealed thermoelectric conversion material layer to a pressure-sensitive adhesive layer, (E) a step of individualizing the thermoelectric conversion material layer into individual chips of a thermoelectric conversion material, and (F) a step of peeling the individualized chips of a thermoelectric conversion material; and a method for producing a thermoelectric conversion module using the chip produced according to the production method.

公开(公告)号：US20200278287A1

公开(公告)日：2020-09-03

申请号：US16877961

申请日：2020-05-19

申请人： LINTEC CORPORATION

发明人： Masaya TODAKA ,  Hiroki HOSHINO ,  Tomoo ORUI

IPC分类号： G01N21/03 ,  B01L3/00

摘要： [Problems] Objects include providing a cover film for testing which can be well fixed to a substrate having a groove and in which a pressure sensitive adhesive does not invade into the groove, providing a testing member comprising the cover film for testing, and providing a method of manufacturing the cover film for testing.[Solution] The cover film for testing (1, 2) comprises a base material (10) and a pressure sensitive adhesive layer (20) laminated on one surface side of the base material (10). The cover film for testing (1, 2) has a region in which the pressure sensitive adhesive layer (20) does not exist in the plan view.