Abstract:
Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described. Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes. Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate. The effect of device operation on incident light is optically sensed. The sensed effect is analyzed to identify device defects. Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.
Abstract:
A tunable liquid crystal optical device defining an optical aperture and having a layered structure. The device includes a film electrode formed on a surface of a first substrate and covered by a second substrate, and a contact structure filling a volume within the layered structure and contacting the film electrode. The contact structure is located outside of the optical aperture and provides an electrical connection surface much larger than a thickness of the film electrode, such that reliable electrical connections may be made to the electrode, particularly in the context of wafer scale manufacturing of such a device.
Abstract:
A tunable liquid crystal optical device defining an optical aperture and having a layered structure. The device includes a film electrode formed on a surface of a first substrate and covered by a second substrate, and a contact structure filling a volume within the layered structure and contacting the film electrode. The contact structure is located outside of the optical aperture and provides an electrical connection surface much larger than a thickness of the film electrode, such that reliable electrical connections may be made to the electrode, particularly in the context of wafer scale manufacturing of such a device.