公开(公告)号：US20210143133A1

公开(公告)日：2021-05-13

申请号：US16699091

申请日：2019-11-28

Applicant: Lextar Electronics Corporation

Inventor： Hung-Chun TONG ,  Fu-Hsin CHEN ,  Wen-Wan TAI ,  Yu-Chun LEE ,  Tzong-Liang TSAI

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/52

Abstract: A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.