公开(公告)号：US20220020900A1

公开(公告)日：2022-01-20

申请号：US16931463

申请日：2020-07-17

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Yu-Chun LEE ,  Fu-Hsin CHEN ,  Chih-Hao LIN

IPC: H01L33/50 ,  H01L33/22 ,  H01L33/48 ,  H01L33/62 ,  H01L27/15

Abstract: A light emitting device includes an LED die and a wavelength conversion layer. The LED die has a light emitting top surface and light emitting side surfaces. The wavelength conversion layer contains quantum dots and a photosensitive material, and is located on the light emitting top surface. A light emitting module including multiple light emitting devices is also disclosed.

公开(公告)号：US20210120711A1

公开(公告)日：2021-04-22

申请号：US16693399

申请日：2019-11-25

Applicant: Lextar Electronics Corporation

Inventor： Chi-Wei LIU ,  Fu-Hsin CHEN ,  Yu-Chun LEE

IPC: H05K13/04 ,  B25J15/00 ,  B25J15/04

Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

公开(公告)号：US20200287104A1

公开(公告)日：2020-09-10

申请号：US16809531

申请日：2020-03-04

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Yu-Chun LEE ,  Fu-Hsin CHEN ,  Jo-Hsiang CHEN ,  Chien-Nan YEH

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/62

Abstract: A package includes a substrate and a plurality of light-emitting chips. The substrate has a top surface. The light-emitting chips are disposed on the top surface of the substrate, in which a sum of the vertical projection areas of the light-emitting chips on the top surface of the substrate is less than 5% of an area of the top surface of the substrate.

公开(公告)号：US20210143133A1

公开(公告)日：2021-05-13

申请号：US16699091

申请日：2019-11-28

Applicant: Lextar Electronics Corporation

Inventor： Hung-Chun TONG ,  Fu-Hsin CHEN ,  Wen-Wan TAI ,  Yu-Chun LEE ,  Tzong-Liang TSAI

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/52

Abstract: A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

公开(公告)号：US20210134625A1

公开(公告)日：2021-05-06

申请号：US16693400

申请日：2019-11-25

Applicant: Lextar Electronics Corporation

Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE

IPC: H01L21/67

Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes an elastic plate, a substrate, a temperature-controlled adhesive layer, at least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to each other. The substrate is disposed on the first surface. The temperature-controlled adhesive layer is disposed on the second surface and configured to adhere the micro elements. The heating element is disposed between the second surface and the temperature-controlled adhesive layer. The power source is electrically connected with the heating element. A viscosity of the temperature-controlled adhesive layer varies with a temperature of the temperature-controlled adhesive layer.

公开(公告)号：US20200126955A1

公开(公告)日：2020-04-23

申请号：US16198790

申请日：2018-11-22

Applicant: Lextar Electronics Corporation

Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60

Abstract: A display device includes a driving substrate, multiple light-emitting elements, first and second transparent substrates, multiple pixels, and a patterned light-absorbing layer. The light-emitting elements are disposed on the driving substrate and used to emit a light. The first transparent substrate is disposed over the driving substrate and the light-emitting elements and includes at least one groove. The pixels are disposed in the groove and include a first sub-pixel, a second sub-pixel, and a third sub-pixel respectively aligned with one of the light-emitting elements. The second transparent substrate covers the first transparent substrate and the pixels. The patterned light-absorbing layer is disposed on the second transparent substrate and includes multiple first openings respectively aligned with the first, second, and third sub-pixels. The first, second, and third sub-pixels correspond to the light emitted by the light-emitting elements to respectively emit a red light, a green light, and a blue light.

公开(公告)号：US20230260979A1

公开(公告)日：2023-08-17

申请号：US17739310

申请日：2022-05-09

Applicant: Lextar Electronics Corporation

Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE ,  Cheng-Ta KUO ,  Jian-Chin LIANG ,  Tzong-Liang TSAI ,  Shiou-Yi KUO ,  Chien-Nan YEH

IPC: H01L25/16 ,  H01L33/52 ,  H01L23/00 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L25/167 ,  H01L33/52 ,  H01L24/20 ,  H01L24/95 ,  H01L33/62 ,  H01L33/60 ,  H01L33/507

Abstract: A pixel package is provided. The pixel package includes a flexible redistribution layer and a plurality of LED chips arranged on the surface of the flexible redistribution layer in a flip-chip manner. The pixel package also includes a plurality of light-adjusting layers respectively disposed on the LED chips. The pixel package further includes a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between the LED chips.

公开(公告)号：US20210135063A1

公开(公告)日：2021-05-06

申请号：US16698980

申请日：2019-11-28

Applicant: Lextar Electronics Corporation

Inventor： Fu-Hsin CHEN ,  Yu-Chun Lee ,  Hung-Chun Tong ,  Tzong-Liang Tsai

IPC: H01L33/50 ,  H01L33/06 ,  H01L33/00 ,  H01L25/075

Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.

公开(公告)号：US20200127171A1

公开(公告)日：2020-04-23

申请号：US16203568

申请日：2018-11-28

Applicant: Lextar Electronics Corporation

Inventor： Hung-Chun TONG ,  Chang-Zhi ZHONG ,  Fu-Hsin CHEN ,  Yu-Chun LEE

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/20 ,  H01L33/00

Abstract: A light emitting diode device includes a light emitting diode chip, a wavelength conversion layer including a bottom surface facing a top surface of the light emitting diode chip, and an interlayer having a first portion between the light emitting diode chip and a part of the bottom surface of the wavelength conversion layer, and a second portion extending from the first portion and connected between a remaining part of the bottom surface of the wavelength conversion layer and a side surface of the light emitting diode chip. The second portion has a side surface including a linear surface substantially aligning with a side surface of the wavelength conversion layer, and a curved surface having a first end connected to the linear surface and a second end connected to the side surface of the light emitting diode chip. The linear surface and the curved surface define a chamfer angle.