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1.发明申请公开(公告)号：US20100295091A1
公开(公告)日：2010-11-25
申请号：US12782851
申请日：2010-05-19
IPC分类号： H01L33/52 , G02F1/1339 , C08L37/00 , C08K5/54 , C08K5/1515 , B32B37/14
CPC分类号： C08L23/08 , C08L23/06 , C08L23/0869 , C08L23/0884 , C08L51/06 , C08L2205/02 , C08L2205/035 , C08L2666/02 , C09J123/0884 , H01L31/0481 , H01L33/56 , Y02E10/50 , Y10T156/1089 , C08L2666/06
摘要： An encapsulant composition containing about 15 to about 50 wt % of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt % of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt % of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt % of polyethylene, about 0.05 to about 5 wt % of an adhesion promoter; and optionally about 0.01 to about 2 wt % of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method.
摘要翻译： 包含约15至约50重量％的乙烯/丙烯酸乙酯/马来酸酐共聚物的包封剂组合物，其含有约20至约40重量％的乙烯/（甲基）丙烯酸缩水甘油酯共聚物; 约2至约30重量％的乙烯/丙烯酸丁酯/马来酸酐共聚物; 约5至约50重量％的聚乙烯，约0.05至约5重量％的粘合促进剂; 和任选的约0.01至约2重量％的至少一种添加剂。 该组合物可用于封装薄膜器件。 本公开还涉及一种封装具有该组合物的薄膜器件的方法以及通过该方法生产的器件。
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公开(公告)号：US08680197B2
公开(公告)日：2014-03-25
申请号：US13139343
申请日：2009-12-14
IPC分类号： B01F17/00 , C08L23/00 , H02N6/00 , H01L31/042
CPC分类号： C09D123/0869 , C08L23/06 , C08L23/0869 , C08L23/0884 , C08L2205/02 , C08L2205/03 , C09D123/0884 , H01L31/0481 , H01L31/049 , Y02E10/50 , C08L2666/02
摘要： The invention relates to the use in a photovoltaic module of a film of a composition as a backsheet or as an encapsulant, this composition comprising, with respect to the total weight of the composition: from 1 to 99% of a polyethylene having an ethylene whose level by weight is greater than or equal to 80% chosen from the homopolymers of ethylene and the copolymers of ethylene and another alpha-olefin; from 99 to 1% of a polyolefin B, other than A, carrying a reactive functional group X chosen from the anhydride carboxylic acids and epoxides. The invention also relates to, the composition additionally comprises a polyolefin C, other than B, which carries a functional group Y capable of reacting with the functional group X. The invention further relates to a photovoltaic module comprising the film which is used of the composition and also a process for the manufacture of this module.
摘要翻译： 本发明涉及光伏组件中作为底片或作为密封剂的组合物的薄膜的用途，该组合物相对于组合物的总重量包括：1至99％的具有乙烯的聚乙烯 重量百分比大于或等于80％，选自乙烯均聚物和乙烯与另一种α-烯烃的共聚物; 99％至1％的除A之外的聚烯烃B，其携带选自酸酐羧酸和环氧化物的反应性官能团X. 本发明还涉及该组合物另外包含除B之外的聚烯烃C，该聚烯烃带有能够与官能团X反应的官能团Y.本发明还涉及包含该组合物的膜的光伏组件 以及制造该模块的过程。
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公开(公告)号：US08653166B2
公开(公告)日：2014-02-18
申请号：US12782851
申请日：2010-05-19
IPC分类号： C08K5/15
CPC分类号： C08L23/08 , C08L23/06 , C08L23/0869 , C08L23/0884 , C08L51/06 , C08L2205/02 , C08L2205/035 , C08L2666/02 , C09J123/0884 , H01L31/0481 , H01L33/56 , Y02E10/50 , Y10T156/1089 , C08L2666/06
摘要： An encapsulant composition containing about 15 to about 50 wt % of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt % of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt % of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt % of polyethylene, about 0.05 to about 5 wt % of an adhesion promoter; and optionally about 0.01 to about 2 wt % of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method.
摘要翻译： 包含约15至约50重量％的乙烯/丙烯酸乙酯/马来酸酐共聚物的包封剂组合物，其含有约20至约40重量％的乙烯/（甲基）丙烯酸缩水甘油酯共聚物; 约2至约30重量％的乙烯/丙烯酸丁酯/马来酸酐共聚物; 约5至约50重量％的聚乙烯，约0.05至约5重量％的粘合促进剂; 和任选的约0.01至约2重量％的至少一种添加剂。 该组合物可用于封装薄膜器件。 本公开还涉及一种封装具有该组合物的薄膜器件的方法以及通过该方法生产的器件。
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