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公开(公告)号:USRE50427E1
公开(公告)日:2025-05-13
申请号:US18621286
申请日:2024-03-29
Applicant: MARKFORGED, INC.
Inventor: Gregory Thomas Mark , Rick Bryan Woodruff , Keith Durand , Benjamin Hodsdon Gallup , Michelle Ling Chao
IPC: F27B17/00 , B22F3/10 , B29C64/295 , B33Y30/00 , B33Y40/00 , C04B35/64 , B22F10/12 , B22F10/14 , B22F10/18 , B22F10/43 , B22F10/73 , B22F10/80 , B22F12/55 , B29C64/165
Abstract: According to one aspect, embodiments herein provide a furnace for debinding and sintering additively manufactured parts comprising a unitarily formed retort having at least one open side, a heater for heating a sintering volume within the retort to a debinding temperature and to a sintering temperature, an end cap sealing the at least one open side, a forming gas line penetrating the end cap for supplying forming gas at a flowrate, and a heat exchanger within the retort, outside the sintering volume, and adjacent a heated wall of the retort, the heat exchanger having an inlet connected to the forming gas line and an outlet to the sintering volume, wherein the heat exchanger includes a heat exchange tube length sufficient to heat the forming gas to within 20 degrees Celsius of the sintering temperature before the forming gas exits the outlet.
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公开(公告)号:US20210178691A1
公开(公告)日:2021-06-17
申请号:US17120541
申请日:2020-12-14
Applicant: MARKFORGED, INC.
Inventor: Gregory Thomas Mark , Benjamin Hodsdon Gallup
IPC: B29C64/35 , B33Y10/00 , B33Y30/00 , B33Y40/20 , B28B1/00 , B22F10/14 , B22F10/68 , B22F12/53 , B22F12/52 , B22F12/63 , B29C64/165 , B29C64/209 , B29C64/218 , B29C64/329
Abstract: A system, apparatus and methods of additively manufacturing an object is disclosed. Specifically, provided herein are systems and methods of distributing powder within a build chamber for a layer-by-layer binderjet process. Distributing powder including apparatus and methods for uniformly densifying powder within the build chamber are also disclosed herein.
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公开(公告)号:US20240351276A1
公开(公告)日:2024-10-24
申请号:US18644252
申请日:2024-04-24
Applicant: MARKFORGED, INC.
Inventor: Jessica Faust , Joseph Roy-Mayhew , Peter Kelly , Benjamin Hodsdon Gallup , Jonathan Matthew Bond
IPC: B29C64/194 , B29C64/118 , B29K77/00 , B29K105/00 , B29K105/08 , B29K105/16 , B29K307/04 , B29L11/00 , B33Y10/00 , B33Y40/00
CPC classification number: B29C64/194 , B29C64/118 , B33Y10/00 , B33Y40/00 , B29K2077/00 , B29K2105/0094 , B29K2105/08 , B29K2105/16 , B29K2307/04 , B29K2995/0077 , B29L2011/0058
Abstract: Methods of infiltrating a three-dimensional part with a resin are disclosed. The methods include designing a part to be printed, the part having at least one inlet and an infill pattern. The methods include using three-dimensional printing to print the designed part. The methods further include infiltrating the printed part using a resin delivered to an interior of the part via the at least one inlet to surround the infill pattern with the resin. The methods additionally include allowing the infiltrated resin to cure.
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公开(公告)号:US20210213534A1
公开(公告)日:2021-07-15
申请号:US17145695
申请日:2021-01-11
Applicant: MARKFORGED, INC.
Inventor: Gregory Thomas Mark , Christopher Hoffmann , Benjamin Hodsdon Gallup , Maxim Seleznev , Michelle Ling Chao
Abstract: Systems, apparatus and methods of additively manufacturing objects are disclosed. Specifically, provided herein are methods of heating objects having a particle-based support at least partially surrounding the object during portions of stages of the heating. Additionally, systems, apparatus, and methods for removing the particle-based support during heating, such that the object can continue heating to form a final part. Systems, apparatus, and methods for distributing the particle-based support to shore the objects through heating are disclosed. Systems, apparatus, and methods for removing the particle-based support are also disclosed herein.
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公开(公告)号:US11988381B2
公开(公告)日:2024-05-21
申请号:US16897529
申请日:2020-06-10
Applicant: Markforged, Inc.
Inventor: Michelle Chao , Keith Durand , Rick Bryan Woodruff , Benjamin Hodsdon Gallup
IPC: F23G7/06 , B22F3/00 , F23G7/07 , F27B5/14 , F27B5/18 , F27D17/00 , F27B5/06 , F27B5/16 , F27D9/00 , F27D19/00
CPC classification number: F23G7/065 , B22F3/003 , F23G7/07 , F27B5/14 , F27B5/18 , F27D17/008 , F23G2207/10 , F23G2207/101 , F23G2207/30 , F23G2209/14 , F27B2005/068 , F27B2005/161 , F27D2009/0037 , F27D2019/0015 , F27D2019/0018 , F27D2019/0068
Abstract: Apparatus and methods for debinding articles. The apparatus and methods may transform binder from furnace exhaust before the exhaust is discharged to the atmosphere. The apparatus may include a furnace retort and a reactor. The furnace retort may be configured to: exclude ambient air; and receive a carrier gas. The reactor may be configured to: receive from the retort (a) the carrier gas and (b) material removed in the retort from the article; and combust, at a temperature no greater than 750° C., the material. The material may be decomposed binder. The material may be hydrocarbon from binder that is pyrolyzed in the retort. The carrier gas may include gas that is nonflammable gas.
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公开(公告)号:US11701710B2
公开(公告)日:2023-07-18
申请号:US17145695
申请日:2021-01-11
Applicant: MARKFORGED, INC.
Inventor: Gregory Thomas Mark , Christopher Hoffman , Benjamin Hodsdon Gallup , Maxim Seleznev , Michelle Ling Chao
CPC classification number: B22F10/14 , B22F10/43 , B22F10/64 , B22F10/66 , B22F10/68 , B33Y10/00 , B33Y30/00 , B22F2999/00 , B22F10/66 , B22F10/68 , B22F3/1025 , B22F2202/15
Abstract: Systems, apparatus and methods of additively manufacturing objects are disclosed. Specifically, provided herein are methods of heating objects having a particle-based support at least partially surrounding the object during portions of stages of the heating. Additionally, systems, apparatus, and methods for removing the particle-based support during heating, such that the object can continue heating to form a final part. Systems, apparatus, and methods for distributing the particle-based support to shore the objects through heating are disclosed. Systems, apparatus, and methods for removing the particle-based support are also disclosed herein.
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