公开(公告)号：US20210181821A1

公开(公告)日：2021-06-17

申请号：US16718099

申请日：2019-12-17

Applicant: MEDIATEK INC.

Inventor： Pei-Yu Huang ,  Chih-Yuan Hsiao ,  Chiao-Pin Fan ,  Chi-Wen Pan ,  Tai-Yu Chen ,  Chien-Tse Fang ,  Jih-Ming Hsu ,  Yun-Ching Li

IPC: G06F1/20 ,  G06F1/3206

Abstract: The present invention provides a method of dynamic thermal management applied to a portable device, wherein the method includes the steps of: obtaining a surface temperature of the portable device; obtaining a junction temperature of a chip of the portable device; and calculating an upper limit of the junction temperature according to the junction temperature and the surface temperature.

公开(公告)号：US11762439B2

公开(公告)日：2023-09-19

申请号：US16718099

申请日：2019-12-17

Applicant: MEDIATEK INC.

Inventor： Pei-Yu Huang ,  Chih-Yuan Hsiao ,  Chiao-Pin Fan ,  Chi-Wen Pan ,  Tai-Yu Chen ,  Chien-Tse Fang ,  Jih-Ming Hsu ,  Yun-Ching Li

IPC: G05D23/00 ,  G06F1/20 ,  G06F1/3206

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F1/3206

Abstract: The present invention provides a method of dynamic thermal management applied to a portable device, wherein the method includes the steps of: obtaining a surface temperature of the portable device; obtaining a junction temperature of a chip of the portable device; and calculating an upper limit of the junction temperature according to the junction temperature and the surface temperature.