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    Thermal control method and thermal control system
    3.
    发明授权
    Thermal control method and thermal control system 有权
    热控制方法和热控系统

    公开(公告)号：US09521246B2

    公开(公告)日：2016-12-13

    申请号：US14670418

    申请日：2015-03-27

    Applicant: MEDIATEK INC.

    Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Wen-Tsan Hsieh ,  Tai-Yu Chen ,  Chia-Feng Yeh ,  Chien-Tse Fang

    IPC: H04M1/725 ,  G06F1/20

    CPC classification number: H04M1/72569 ,  G06F1/206 ,  H04M1/72525 ,  H04M1/72577

    Abstract: The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.

    Abstract translation: 本发明提供一种热控制方法和热控制系统。 热控制方法包括：检测电子设备的部件的温度变化以产生检测结果; 以及根据检测结果确定集成电路的温度阈值作为节流点。 热控制系统包括：检测单元，用于检测电子设备的部件的温度变化以产生检测结果; 以及确定单元，用于根据检测结果将集成电路的温度阈值确定为节流点。

    THERMAL MANAGEMENT FOR CONCURRENT WORKLOAD EXECUTION AND FAST CHARGING
    4.
    发明申请
    THERMAL MANAGEMENT FOR CONCURRENT WORKLOAD EXECUTION AND FAST CHARGING 审中-公开

    公开(公告)号：US20180026451A1

    公开(公告)日：2018-01-25

    申请号：US15472235

    申请日：2017-03-28

    Applicant: MediaTek Inc.

    Inventor： Chih-Yuan Hsiao ,  Chien-Tse Fang ,  Wei-Ting Wang ,  Yung-Cheng Huang ,  Jia-You Chuang

    IPC: H02J7/00

    CPC classification number: H02J7/007 ,  G06F1/206 ,  G06F1/26 ,  H02J7/00 ,  H02J7/0021 ,  H02J7/0068 ,  H02J7/04

    Abstract: A mobile device performs thermal management during concurrent battery charging and workload execution based on a thermal headroom. The thermal headroom is an amount of power, in a form of heat, that heat dissipation hardware in the mobile device is estimated to dissipate when the mobile device operates at a target temperature. After the thermal headroom is determined, the mobile device determines a first power allocation to system loading, which is caused by one or more applications running on the mobile device. The first power allocation is subtracted from the thermal headroom to obtain a second power allocation to a charger, which charges a battery module of the mobile device while the one or more application are running. The mobile device then sets an input power limit of the charger based on the second power allocation.

    Method for Power Budget
    5.
    发明申请
    Method for Power Budget 审中-公开
    电力预算方法

    公开(公告)号：US20170063088A1

    公开(公告)日：2017-03-02

    申请号：US14937576

    申请日：2015-11-10

    Applicant: MEDIATEK INC.

    Inventor： Wei-Ting Wang ,  Yingshiuan Pan ,  Chien-Tse Fang

    IPC: H02J3/14 ,  G05B15/02

    CPC classification number: G05B15/02 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172

    Abstract: Methods and apparatus are provided for adjusting the power limit based on multiple factors including the current temperature, the previous temperature, and the target temperature. In one novel aspect, the device obtains the total power limit based on the base power and the delta power. The base power is set to be the current power if the temperature-jump is higher than a temperature-jump threshold, otherwise, is set to be the previous power limit. The delta power equals to the weighted conversion sum of the temperature jump and the temperature margin, which is the temperature difference between the current temperature and the target temperature. In another novel aspect, the device calculates one or more component power limit for each corresponding component power source of the device based on the total power limit. The device adjusts power settings for each corresponding component power source based on the component power limit.

    Abstract translation: 提供了用于基于包括当前温度，先前温度和目标温度的多个因素来调节功率极限的方法和装置。 在一个新颖的方面，设备基于基本功率和增量功率获得总功率限制。 如果温度跳变高于温度跳变阈值，则基本功率设置为当前功率，否则设置为先前的功率限制。 δ功率等于温度跳变和温度裕度的加权转换和，即当前温度与目标温度之间的温差。 在另一个新颖的方面，设备基于总功率限制来计算设备的每个相应组件功率源的一个或多个组件功率限制。 该设备根据组件功率限制调整每个相应组件电源的电源设置。

    THERMAL PROTECTION METHOD FOR REFERRING TO THERMAL HEADROOM TO CONTROL SELECTION OF COMPUTING POWER SETTING OF PROCESSOR-BASED SYSTEM AND RELATED MACHINE READABLE MEDIUM
    6.
    发明申请
    THERMAL PROTECTION METHOD FOR REFERRING TO THERMAL HEADROOM TO CONTROL SELECTION OF COMPUTING POWER SETTING OF PROCESSOR-BASED SYSTEM AND RELATED MACHINE READABLE MEDIUM 审中-公开
    用于引导热源的热保护方法以控制基于处理器的系统的计算功率选择和相关机器可读介质的选择

    公开(公告)号：US20160034009A1

    公开(公告)日：2016-02-04

    申请号：US14700111

    申请日：2015-04-29

    Applicant: Mediatek Inc.

    Inventor： Wei-Ting Wang ,  Chien-Tse Fang ,  Chia-Feng Yeh

    IPC: G06F1/20

    CPC classification number: G06F1/206

    Abstract: A thermal protection method includes: determining a thermal headroom based on a difference between a current temperature and a predetermined threshold temperature; determining a power budget based on the thermal headroom; and utilizing a processor-based system to employ a target computing power setting according to at least the power budget, wherein selection of the target computing power setting is constrained by the power budget to ensure that the target computing power setting does not make the current temperature exceed the predetermined threshold temperature when employed by the processor-based system.

    Abstract translation: 热保护方法包括：基于当前温度和预定阈值温度之间的差来确定热余量; 基于热余量确定功率预算; 并且利用基于处理器的系统来根据至少功率预算来采用目标计算能力设置，其中目标计算能力设置的选择受功率预算约束，以确保目标计算功率设置不使当前温度 在基于处理器的系统使用时超过预定阈值温度。

    THERMAL CONTROL METHOD AND THERMAL CONTROL SYSTEM
    7.
    发明申请
    THERMAL CONTROL METHOD AND THERMAL CONTROL SYSTEM 有权
    热控制方法和热控制系统

    公开(公告)号：US20150350407A1

    公开(公告)日：2015-12-03

    申请号：US14670418

    申请日：2015-03-27

    Applicant: Mediatek Inc.

    Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Wen-Tsan Hsieh ,  Tai-Yu Chen ,  Chia-Feng Yeh ,  Chien-Tse Fang

    IPC: H04M1/725

    CPC classification number: H04M1/72569 ,  G06F1/206 ,  H04M1/72525 ,  H04M1/72577

    Abstract: The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.

    Abstract translation: 本发明提供一种热控制方法和热控制系统。 热控制方法包括：检测电子设备的部件的温度变化以产生检测结果; 以及根据检测结果确定集成电路的温度阈值作为节流点。 热控制系统包括：检测单元，用于检测电子设备的部件的温度变化以产生检测结果; 以及确定单元，用于根据检测结果将集成电路的温度阈值确定为节流点。

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