公开(公告)号：US20240196537A1

公开(公告)日：2024-06-13

申请号：US18510815

申请日：2023-11-16

Applicant: MEDIATEK INC.

Inventor： Hui-Chi TANG ,  Pei-San CHEN ,  Shao-Chun HO ,  Bo-Jiun YANG

IPC: H05K1/18 ,  H01L25/16 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L25/16 ,  H05K1/0296 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.