公开(公告)号：US20240312893A1

公开(公告)日：2024-09-19

申请号：US18594446

申请日：2024-03-04

Applicant: MEDIATEK INC.

Inventor： Hui-Chi TANG ,  Shih-Yi SYU ,  Hao-Ju WANG ,  Pei-San CHEN ,  Duen-Yi HO

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/14361

Abstract: An electronic device is provided. The electronic device includes a base and a semiconductor device. The base has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the base. The semiconductor device has a device edge located within the base in a top view. The base has a unit pad array which is covered by the semiconductor device and electrically connected to the semiconductor device. The unit pad array includes a first pad region composed of a first row and a second row of the unit pad array. The first pad region includes first pads for transmitting commands and addresses to and from the semiconductor device. The first row of the unit pad array is arranged so that it is closer to the device edge than the second row of the unit pad array.

公开(公告)号：US20240196537A1

公开(公告)日：2024-06-13

申请号：US18510815

申请日：2023-11-16

Applicant: MEDIATEK INC.

Inventor： Hui-Chi TANG ,  Pei-San CHEN ,  Shao-Chun HO ,  Bo-Jiun YANG

IPC: H05K1/18 ,  H01L25/16 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L25/16 ,  H05K1/0296 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.