公开(公告)号：US20230282626A1

公开(公告)日：2023-09-07

申请号：US18163417

申请日：2023-02-02

申请人： MEDIATEK INC.

发明人： Tai-Yu CHEN ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Yin-Fa CHEN ,  Ta-Jen YU ,  Bo-Hao MA ,  Wen-Sung HSU ,  Yao-Pang HSU

IPC分类号： H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/14

CPC分类号： H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L23/147 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1511 ,  H01L2924/152

摘要： A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

公开(公告)号：US20240196537A1

公开(公告)日：2024-06-13

申请号：US18510815

申请日：2023-11-16

申请人： MEDIATEK INC.

发明人： Hui-Chi TANG ,  Pei-San CHEN ,  Shao-Chun HO ,  Bo-Jiun YANG

IPC分类号： H05K1/18 ,  H01L25/16 ,  H05K1/02

CPC分类号： H05K1/181 ,  H01L25/16 ,  H05K1/0296 ,  H01L24/16 ,  H01L2224/16227

摘要： A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.

公开(公告)号：US20230260866A1

公开(公告)日：2023-08-17

申请号：US18157159

申请日：2023-01-20

申请人： MEDIATEK INC.

发明人： Yin-Fa CHEN ,  Bo-Jiun YANG ,  Ta-Jen YU ,  Bo-Hao MA ,  Chih-Wei CHANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13

CPC分类号： H01L23/3675 ,  H01L24/73 ,  H01L24/16 ,  H01L24/32 ,  H01L24/17 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/13 ,  H01L2924/1511 ,  H01L2924/15151 ,  H01L2924/152 ,  H01L2924/15331 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/17051 ,  H01L2924/1011

摘要： A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.

公开(公告)号：US20240274517A1

公开(公告)日：2024-08-15

申请号：US18418419

申请日：2024-01-22

申请人： MEDIATEK INC.

发明人： Fa-Chuan CHEN ,  Ta-Jen YU ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC分类号： H01L23/498 ,  H01L21/28 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/49816 ,  H01L21/28132 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L25/0652 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2924/01029 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/351

摘要： A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

公开(公告)号：US20230197667A1

公开(公告)日：2023-06-22

申请号：US18172409

申请日：2023-02-22

申请人： MEDIATEK Inc.

发明人： Yu-Jin LI ,  Bo-Jiun YANG ,  Tai-Yu CHEN ,  Tsung-Yu PAN ,  Chun-Yin LIN

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/373 ,  H01L24/16 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/49816

摘要： A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.

公开(公告)号：US20230046413A1

公开(公告)日：2023-02-16

申请号：US17812786

申请日：2022-07-15

申请人： MEDIATEK INC.

发明人： Tai-Yu CHEN ,  Chin-Lai CHEN ,  Hsiao-Yun CHEN ,  Wen-Sung HSU ,  Haw-Kuen SU ,  Duen-Yi HO ,  Bo-Jiun YANG ,  Ta-Jen YU ,  Bo-Hao MA

IPC分类号： H01L25/10 ,  H01L25/18

摘要： A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.

公开(公告)号：US20220328378A1

公开(公告)日：2022-10-13

申请号：US17700571

申请日：2022-03-22

申请人： MEDIATEK Inc.

发明人： Bo-Jiun YANG ,  Wen-Sung HSU ,  Tai-Yu CHEN ,  Sheng-Liang KUO ,  Chia-Hao HSU

IPC分类号： H01L23/42 ,  H01L21/48

摘要： A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.