公开(公告)号：US20230063481A1

公开(公告)日：2023-03-02

申请号：US17463587

申请日：2021-09-01

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Amir Silber ,  Barak Freedman ,  Nizan Meitav ,  Santiago Echeverri ,  Jochem Verbist ,  Allan Green-Petersen

IPC: G01R31/26 ,  G01R1/24

Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.

公开(公告)号：US20220276452A1

公开(公告)日：2022-09-01

申请号：US17649849

申请日：2022-02-03

Applicant: Mellanox Technologies, Ltd.

Inventor： Barak Freedman ,  Henning Lysdal ,  Amir Silber ,  Nizan Meitav

IPC: G02B6/42

Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.

公开(公告)号：US12174238B2

公开(公告)日：2024-12-24

申请号：US17463587

申请日：2021-09-01

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Amir Silber ,  Barak Freedman ,  Nizan Meitav ,  Santiago Echeverri ,  Jochem Verbist ,  Allan Green-Petersen

IPC: G01R31/26 ,  G01R1/24

Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.

公开(公告)号：US12135461B2

公开(公告)日：2024-11-05

申请号：US17649849

申请日：2022-02-03

Applicant: Mellanox Technologies, Ltd.

Inventor： Barak Freedman ,  Henning Lysdal ,  Amir Silber ,  Nizan Meitav

IPC: G02B6/42 ,  G02B6/30

Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.