公开(公告)号：US20030127336A1

公开(公告)日：2003-07-10

申请号：US10271574

申请日：2002-10-15

Applicant: MEMGen Corporation

Inventor： Adam L. Cohen ,  Gang Zhang ,  Qui T. Le ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D005/02

CPC classification number: B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

Abstract: Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEXnull) process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the ELEXnull process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of EFABnull.

公开(公告)号：US20040007469A1

公开(公告)日：2004-01-15

申请号：US10434498

申请日：2003-05-07

Applicant: MEMGen Corporation

Inventor： Gang Zhang ,  Qui T. Le

IPC: C25D005/02

CPC classification number: C25D1/003 ,  C25D3/38 ,  H01L21/2885 ,  H01L21/76885

Abstract: An electrochemical fabrication process and apparatus are provided that can form three-dimensional multi-layer structures using pyrophosphate copper plating solutions that contain citrate salts, selenium oxide, and/or excess ammonium salts. In some embodiments the citrate salts are provided in concentrations that yield improved anode dissolution, reduced formation of pinholes on the surface of deposits, reduced likelihood of shorting between anode and cathode during deposition processes, and reduced plating voltage throughout the period of deposition. A preferred citrate salt is ammonium citrate in concentrations ranging from somewhat more that about 10 g/L for 10 mA/cm2 current density to as high as 200 g/L or more for a current density as high as 40 mA/cm. In some embodiments deposits having enhanced ductility and/or reduced tendency to crack are provided.

Abstract translation: 提供一种电化学制造方法和装置，其可以使用含有柠檬酸盐，氧化硒和/或过量铵盐的焦磷酸铜电镀溶液形成三维多层结构。 在一些实施方案中，柠檬酸盐以提供的阳极溶解，减少沉积物表面上的针孔形成，沉积过程中阳极和阴极之间短路的可能性降低以及在整个沉积期间降低电镀电压的浓度提供。 优选的柠檬酸盐是柠檬酸铵，其浓度范围为10mA / cm 2电流密度稍高于约10g / L，对于高达40mA / cm的电流密度高达200g / L或更高 。 在一些实施例中，提供了具有增强的延展性和/或降低的裂纹倾向的沉积物。