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公开(公告)号：US09920444B2
公开(公告)日：2018-03-20
申请号：US14285376
申请日：2014-05-22
申请人： THE BOEING COMPANY
IPC分类号： C25D1/00 , C22C38/00 , C22C19/03 , B32B15/01 , C25D7/00 , C25D5/12 , B64C27/473 , C25D5/36 , C25D5/40 , C25D7/06 , C23C18/16
CPC分类号： C25D1/003 , B32B15/01 , B32B15/013 , B32B15/015 , B64C27/473 , B64C2027/4733 , C22C19/03 , C22C38/00 , C23C18/1657 , C25D1/00 , C25D5/12 , C25D5/36 , C25D5/40 , C25D7/00 , C25D7/0614 , F03D1/0675 , Y02E10/721 , Y02P70/523 , Y10T428/12806 , Y10T428/12944 , Y10T428/12951 , Y10T428/12972
摘要： A system, method, and apparatus for a co-bonded electroformed abrasion strip are disclosed. A disclosed method for making a unitary abrasion strip for a fluid dynamic surface includes manufacturing or identifying a first metallic section having an overlap region on a first end of the first metallic section. The method further includes manufacturing or identifying an overlap region disposed on the first end of the first metallic section by preparing the first end of the first metallic section. Also, the method includes creating a second metallic section onto the overlap region on the first end of the first metallic section by performing a first electro-deposition process on the first end of the first metallic section; where the first metallic section, the overlap region, and the second metallic section together form a unitary, inseparable abrasion strip for a fluid dynamic surface.
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公开(公告)号：US20170362728A1
公开(公告)日：2017-12-21
申请号：US15533694
申请日：2015-12-11
发明人： Yosuke ABE , Tomoo IKEDA , Ryoichi SHIMA , yoshiki ONO , Taku ASAMI , Yosuke SASAKI
CPC分类号： C25D1/08 , C25D1/003 , C25D1/20 , C25D1/22 , G03F7/0035 , G03F7/094 , G03F7/095 , G03F7/40 , G04B13/02 , G04B15/14 , G04B17/066 , G04D3/0069 , H01L21/2885
摘要： In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.
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公开(公告)号：US20170362727A1
公开(公告)日：2017-12-21
申请号：US15183224
申请日：2016-06-15
CPC分类号： C25D1/003 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C25D1/00 , C25D1/08 , C25D1/20 , C25D5/022 , C25D7/04 , C25D15/00
摘要： In certain embodiments, a method comprises placing nonconductive fibers adjacent to a conductive material, immersing the nonconductive fibers and the conductive material in a plating medium, and applying a voltage to the conductive material to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.
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公开(公告)号：US09841438B2
公开(公告)日：2017-12-12
申请号：US15359157
申请日：2016-11-22
发明人： Teppei Kimura , Liwen Fan
CPC分类号： G01R1/07371 , C25D1/003 , C25D5/02 , C25D5/48 , G01R1/07357 , G01R1/18 , G01R3/00 , G01R31/2889
摘要： It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
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公开(公告)号：US09831103B2
公开(公告)日：2017-11-28
申请号：US14995207
申请日：2016-01-14
发明人： Dyi-Chung Hu , Ming-Chih Chen , Tzyy-Jang Tseng
IPC分类号： H01L21/48 , C25D7/12 , C25D5/48 , C25D5/34 , C25D5/02 , H05K1/11 , H05K3/46 , C25D1/00 , H05K3/10 , H05K3/42
CPC分类号： H01L21/4857 , C25D1/003 , C25D5/022 , C25D5/34 , C25D5/48 , C25D7/12 , H05K1/113 , H05K3/10 , H05K3/424 , H05K3/4647 , H05K3/4682 , H05K2201/10378 , H05K2203/0152 , H05K2203/0733 , Y10T29/49155
摘要： A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.
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公开(公告)号：US20170287728A1
公开(公告)日：2017-10-05
申请号：US15471401
申请日：2017-03-28
申请人： CORNING INCORPORATED
IPC分类号： H01L21/48 , C25D7/12 , C25D3/38 , H01L21/683 , H01L23/498
CPC分类号： H01L21/486 , C25D1/003 , C25D1/04 , C25D3/38 , C25D5/022 , C25D5/54 , C25D7/12 , C25D7/123 , H01L21/2885 , H01L21/6835 , H01L21/76879 , H01L21/76898 , H01L23/15 , H01L23/49827 , H01L23/49866 , H01L23/49894 , H01L2221/68359
摘要： Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth substrate. The substrate includes a first surface, a second surface, and at least one via. The first surface or the second surface of the substrate directly contacts a surface of the growth substrate, and the surface of the growth substrate is electrically conductive. The method further includes applying an electrolyte to the substrate such that the electrolyte is disposed within the at least one via. The electrolyte includes metal ions of a metal to be deposited within the at least one via. The method also includes positioning an electrode within the electrolyte, and applying a current and/or a voltage between the electrode and the substrate, thereby reducing the metal ions into the metal on the surface of the growth substrate within the at least one via.
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公开(公告)号：US20170263994A1
公开(公告)日：2017-09-14
申请号：US15387362
申请日：2016-12-21
申请人： Microfabrica Inc.
发明人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
摘要： RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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公开(公告)号：US09719184B2
公开(公告)日：2017-08-01
申请号：US13976628
申请日：2011-12-23
申请人： Hong Xu
发明人： Hong Xu
IPC分类号： B05B1/00 , C25D7/00 , B05B17/00 , B41J2/16 , C25D5/02 , C25D5/10 , C25D1/00 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/54 , C25D5/34 , C25D5/48 , C25D5/54
CPC分类号： C25D7/00 , B05B17/0646 , B41J2/162 , B41J2/1625 , B41J2/1629 , B41J2/1631 , C25D1/003 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/54 , C25D5/022 , C25D5/10 , C25D5/34 , C25D5/48 , C25D5/54
摘要： In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
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公开(公告)号：US09719182B2
公开(公告)日：2017-08-01
申请号：US14799874
申请日：2015-07-15
发明人： Enzo Agustoni
摘要： Method for manufacturing an electroformed timepiece component: the same first alloy including a first precious metal is selected to make both functional inserts and an electroformed shell; these inserts are made; an electroforming substrate having a complementary profile to the inner profile of this component is formed in a second sacrificial material; these inserts are inserted into housings made on this substrate, to form an equipped sacrificial substrate, which is provided with the resists necessary to obtain, by means of an electroforming process, a bare electroformed component, with deposition of material on this substrate, acting as a core to form this electroformed shell, and on each accessible surface of each insert to secure the insert to this electroformed shell; then this sacrificial substrate is destroyed and all of these resists are removed.
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公开(公告)号：US09614266B2
公开(公告)日：2017-04-04
申请号：US14675147
申请日：2015-03-31
申请人： Microfabrica Inc.
发明人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
摘要： RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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