公开(公告)号：US20210343506A1

公开(公告)日：2021-11-04

申请号：US17245803

申请日：2021-04-30

申请人： Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

发明人： Ting Xie ,  Haochen Li ,  Shuang Meng ,  Qiqun Zhang ,  Dave Kohl ,  Shawming Ma ,  Haichun Yang ,  Hua Chung ,  Ryan M. Pakulski ,  Michael X. Yang

IPC分类号： H01J37/32 ,  H01L21/67 ,  H01L21/3065

摘要： Apparatus and methods for processing a workpiece using a plasma are provided. In one example implementation, an apparatus can include a processing chamber. The apparatus can include a plasma chamber comprising a dielectric tube defining a sidewall. The apparatus can include an inductively coupled plasma source. The inductively coupled plasma source can include an RF generator configured to energize an induction coil disposed about the dielectric tube. The apparatus can include a separation grid separating the processing chamber from the plasma chamber. The apparatus can include a controller configured to operate the inductively coupled plasma source in a pulsed mode. During the pulsed mode the RF generator is configured to apply a plurality of pulses of RF power to the induction coil. A frequency of pulses can be in a range of about 1 kHz to about 100 kHz.