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公开(公告)号:US20220334558A1
公开(公告)日:2022-10-20
申请号:US17490663
申请日:2021-09-30
Applicant: MediaTek Inc.
Inventor: Bo-Jr Huang , Jia-Wei Fang , Jia-Ming Chen , Ya-Ting Chang , Chien-Yuan Lai , Cheng-Yuh Wu , Yi-Pin Lin , Wen-Wen Hsieh , Min-Shu Wang
IPC: G05B19/4155
Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.
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公开(公告)号:US11989005B2
公开(公告)日:2024-05-21
申请号:US17490663
申请日:2021-09-30
Applicant: MediaTek Inc.
Inventor: Bo-Jr Huang , Jia-Wei Fang , Jia-Ming Chen , Ya-Ting Chang , Chien-Yuan Lai , Cheng-Yuh Wu , Yi-Pin Lin , Wen-Wen Hsieh , Min-Shu Wang
IPC: G06F1/20 , G05B19/4155
CPC classification number: G05B19/4155 , G06F1/206 , G05B2219/50333
Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.
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